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DS90LV028AH Dataheets PDF



Part Number DS90LV028AH
Manufacturers National Semiconductor
Logo National Semiconductor
Description High Temperature 3V LVDS Dual Differential Line Receiver
Datasheet DS90LV028AH DatasheetDS90LV028AH Datasheet (PDF)

www.DataSheet4U.com DS90LV028AH High Temperature 3V LVDS Dual Differential Line Receiver September 2005 DS90LV028AH High Temperature 3V LVDS Dual Differential Line Receiver General Description The DS90LV028AH is a dual CMOS differential line receiver designed for applications requiring ultra low power dissipation, low noise and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90L.

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www.DataSheet4U.com DS90LV028AH High Temperature 3V LVDS Dual Differential Line Receiver September 2005 DS90LV028AH High Temperature 3V LVDS Dual Differential Line Receiver General Description The DS90LV028AH is a dual CMOS differential line receiver designed for applications requiring ultra low power dissipation, low noise and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV028AH accepts low voltage (350 mV typical) differential input signals and translates them to 3V CMOS output levels. The DS90LV028AH has a flow-through design for easy PCB layout. The DS90LV028AH and companion LVDS line driver DS90LV027AH provide a new alternative to high power PECL/ECL devices for high speed point-to-point interface applications. Features n n n n n n n n n n n n -40˚C to +125˚C operating temperature range > 400 Mbps (200 MHz) switching rates 50 ps differential skew (typical) 0.1 ns channel-to-channel skew (typical) 2.5 ns maximum propagation delay 3.3V power supply design Flow-through pinout Power down high impedance on LVDS inputs Low Power design (18mW @ 3.3V static) LVDS inputs accept LVDS/CML/LVPECL signals Conforms to ANSI/TIA/EIA-644 Standard Available in SOIC package Connection Diagram SOIC Truth Table INPUTS [RIN+] − [RIN−] VID ≥ 0.1V VID ≤ −0.1V OUTPUT ROUT H L 20162901 Order Number DS90LV028AHM See NS Package Number M08A Functional Diagram 20162902 © 2005 National Semiconductor Corporation DS201629 www.national.com DS90LV028AH Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) Input Voltage (RIN+, RIN−) Output Voltage (ROUT) M Package Derate M Package Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260˚C −0.3V to +4V −0.3V to +3.9V −0.3V to VCC + 0.3V 1025 mW 8.2 mW/˚C above +25˚C −65˚C to +150˚C Maximum Junction Temperature ESD Rating (Note 4) (HBM 1.5 kΩ, 100 pF) (EIAJ 0Ω, 200 pF) +150˚C ≥ 7 kV ≥ 500 V Maximum Package Power Dissipation @ +25˚C Recommended Operating Conditions Min Supply Voltage (VCC) Receiver Input Voltage Operating Free Air Temperature (TA) −40 25 +125 ˚C +3.0 GND Typ +3.3 Max +3.6 3.0 Units V V Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3) Symbol VTH VTL IIN Parameter Differential Input High Threshold Differential Input Low Threshold Input Current VIN = +2.8V VIN = 0V VIN = +3.6V VOH Output High Voltage VCC = 0V ROUT IOH = −0.4 mA, VID = +200 mV IOH = −0.4 mA, Inputs terminated IOH = −0.4 mA, Inputs shorted VOL IOS VCL ICC Output Low Voltage Output Short Circuit Current Input Clamp Voltage No Load Supply Current IOL = 2 mA, VID = −200 mV VOUT = 0V (Note 5) ICL = −18 mA Inputs Open VCC −15 −1.5 VCC = 3.6V or 0V Conditions VCM = +1.2V, 0.


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