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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1.1GHz Dual Modulus Prescaler
MC12022A MC12022B
The MC12022A can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145XXX series in a PLL to provide tuning signals up to 1.1GHz in programmable frequency steps. The MC12022B can be used with CMOS synthesizers requiring negative edges to trigger internal counters. A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio.
MECL PLL COMPONENTS ÷64/65, ÷128/129 DUAL MODULUS PRESCALER
• • • • • •
1.1 GHz Toggle Frequency Supply Voltage of 4.5 to 5.5V Low–Power 7.5mA Typical Operating Temperature Range of –40 to +85°C Short Setup Time (tset) 16ns Maximum @ 1.1GHz Modulus Control Input Level Is Compatible With Standard CMOS and TTL. Maximum Input Voltage Should Be Limited to 6.5Vdc Pinout: 8–Lead Plastic (Top View)
IN 8 NC 7 MC 6 GND 5 D SUFFIX 8–LEAD PLASTIC SOIC PACKAGE CASE 751–05 P SUFFIX 8–LEAD PLASTIC PACKAGE CASE 626–05
1 IN
2 VCC
3 SW
4 OUT
FUNCTIONAL TABLE
SW H H L L MC H L H L Divide Ratio 64 65 128 129
Note: SW: H = VCC, L = Open MC: H = 2.0 V to VCC, L = GND to 0.8 V
MAXIMUM RATINGS
Symbol VCC TA Tstg MC
1/97
Characteristic Power Supply Voltage, Pin 2 Operating Temperature Range Storage Temperature Range Modulus Control Input, Pin 6
Range –0.5 to + 7.0 –40 to + 85 –65 to + 150 –0.5 to + 6.5
Unit Vdc °C °C Vdc
© Motorola, Inc. 1997
1
REV 2
MC12022A MC12022B
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5V; TA = –40°C to +85°C)
Symbol ft ICC VIH1 VIL1 VIH2 VIL2 Vout tset Vin IO Characteristic Toggle Frequency (Sine Wave Input) Supply Current Output Unloaded (Pin 2) Modulus Control Input High (MC) Modulus Control Input Low (MC) Divide Ratio Control Input High (SW) Divide Ratio Control Input Low (SW) Output Voltage Swing (CL = 12pF; RL = 2.2kΩ) Modulus Setup Time MC to Out Input Voltage Sensitivity 250–1100 MHz 100–250 MHz Output Current (CL = 12pF; RL = 2.2kΩ) 100 400 1.5 VCC Open 1.0 VCC Open 1.6 11 16 1500 1500 4.0 2.0 Min 0.1 Typ 1.6 7.5 Max 1.1 10 VCC 0.8 VCC Open Unit GHz mA V V Vdc — Vp–p ns mVpp mA
D A C
Q
D B
Q
D C
Q QB
Prop. Delay In
QB
C
QB
C M
In In Out MC MC Setup
D D C QB C Q D QB E Q C D F QB C Q D QB G Q D H C S Q QB
MC
Out
MC Release Modulus setup time MC to out is the MC setup or MC release plus the prop delay.
SW
Figure 1. Logic Diagram (MC12022A)
Figure 2. Modulus Setup Time
500 m ≈
20 ns
500 m ≈
20 ns
(÷64, 500MHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded)
(÷128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded)
Figure 3. Typical Output Waveforms
MOTOROLA
2
HIPERCOMM BR1334 — Rev 4
MC12022A MC12022B
VCC = 4.5 to 5.5 V C3 Sine Wave Generator C1 50Ω C2 IN MC GND IN OUT RL CL EXTERNAL COMPONETS C1 = C2 = 1000pF C3 = 0.1µF CL = 12pF (Including Scope and jig capacitance) RL = 2.2kΩ VCC SW
MC Input Figure 4. AC Test Circuit
+15.0 +10.0 +5.0 0 –5.0 AMPLITUDE (dBm) –10.0 –15.0 –20.0 –25.0 –30.0 –35.0 –40.0 –45.0 –50.0 0 250 500 750 1000 1250 1500 1750 2000 FREQUENCY (MHz)
+1257.40 +707.11 +397.64 +223.61 +125.74 +70.71 +39.76 +22.36 +12.57 +7.07 +3.98 +2.24 +1.26 +0.71 2250 MILLIVOLTS MILLIVOLTS
Figure 5. Input Signal Amplitude versus Input Frequency Divide Ratio = 8; VCC = 5.0V; TA = 25°C
2000 AMPLITUDE (dBm) 1600 1200 800 400 0 250 500 750 1000 1250 1500 1750 2000 0 2250
FREQUENCY (MHz)
Figure 6. Output Amplitude versus Input Frequency
HIPERCOMM BR1334 — Rev 4
3
MOTOROLA
MC12022A MC12022B
1000 900 800 700 600 R 500 400 300 200 100 OHMS 0 0.1 –100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 GHz
–200
jX
–300
–400
–500
–600
Figure 7. Typical Input Impedance versus Input Frequency
MOTOROLA
4
HIPERCOMM BR1334 — Rev 4
MC12022A MC12022B
OUTLINE DIMENSIONS
P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K
NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
8
5
–B–
1 4
F
NOTE 2
–A– L
DIM A B C D F G H J K L M N
C –T–
SEATING PLANE
J N D K
M
M
H
G 0.13 (0.005) T A
M
MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01
INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040
B
M
A
8
D
5
D SUFFIX PLASTIC SOIC PACKAGE CASE 751–05 ISSUE R
C H 0.25
M
E
1 4
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL C.