Standard Card IC
www.DataSheet4U.com
INTEGRATED CIRCUITS
ADDENDUM
Standard Card IC MF1 IC S50 05
Specification “bumped sawn wafer on U...
Description
www.DataSheet4U.com
INTEGRATED CIRCUITS
ADDENDUM
Standard Card IC MF1 IC S50 05
Specification “bumped sawn wafer on UV-tape”
Product Specification Revision 3.0 PUBLIC August 2004
Philips Semiconductors
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE............................................................................................................................. 3 REFERENCE DOCUMENTS.............................................................................................. 3 Philips Documents............................................................................................................. 3 MECHANICAL SPECIFICATION ........................................................................................ 3 Wafer................................................................................................................................ 3 Wafer Backside ................................................................................................................. 3 Chip Dimensions ............................................................................................................... 3 Passivation........................................................................................................................ 3 Au Bump.......................................................................
Similar Datasheet