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PD - 94190
SCHOTTKY RECTIFIER
HIGH EFFICIENCY SERIES
75LQ150
75 Amp, 150V
Major Ratings and Characteristics
Description/Features The 75LQ150 Schottky rectifier has been expressly designed to meet the rigorous requirements of hi-rel environments. It is packaged in the hermetic surface mount SMD-1 ceramic package. The device's forward voltage drop and reverse leakage current are optimized for the lowest power loss and the highest circuit efficiency for typical high frequency switching power supplies and resonent power converters. Full MIL-PRF-19500 quality conformance testing is available on source control drawings to TX, TXV and S quality levels. • • • • Hermetically Sealed Low Forward Voltage Drop High Frequency Operation Guard Ring for Enhanced Ruggedness and Long term Reliability • Surface Mount • Lightweight
Characteristics IF(AV) VRRM IFSM @ tp = 8.3ms half-sine VF @ 75Apk, TJ =125°C
75LQ150 75
Units A
150 400 0.72
V A V
TJ, Tstg Operating and storage -55 to 150
°C
CASE STYLE
CATHODE ANODE ANODE
IR Case Style SMD-1
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05/31/01
75LQ150
Voltage Ratings
Part number
VR Max. DC Reverse Voltage (V) VRWM Max. Working Peak Reverse Voltage (V)
75LQ150 150
Absolute Maximum Ratings
Parameters
IF(AV) Max. Average Forward Current See Fig. 5 IFSM Max. Peak One Cycle Non - Repetitive Surge Current 400 A @ tp = 8.3 ms half-sine
Limits
75
Units
A
Conditions
50% duty cycle @ TC = 108 °C, square waveform
Electrical Specifications
Parameters
VFM Max. Forward Voltage Drop See Fig. 1Q
Limits
1.22 1.44 0.98 1.27 0.72 0.85
Units
V V V V V V mA mA mA pF nH @ 75A @ 150A @ 75A @ 150A @ 75A @ 150A TJ = 25°C TJ = 100°C TJ = 125°C
Conditions
TJ = -55°C R TJ = 25°C R TJ = 125°C R
I RM
Max. Reverse Leakage Current See Fig. 2Q
0.1 4.0 20
VR = rated VR R
CT LS
Max. Junction Capacitance Typical Series Inductance
1200 5.9
VR = 5VDC ( 1MHz, 25°C ) R Measured from center of cathode pad to center of anode pad
Thermal-Mechanical Specifications
Parameters
TJ Tstg Max.Junction Temperature Range Max. Storage Temperature Range to Case wt Weight (Typical) Die Size (Typical) Case Style 2.6 150X180 SMD-1 g mils
Limits Units
-55 to 150 -55 to 150 0.65 °C °C °C/W DC operation
Conditions
RthJC Max. Thermal Resistance, Junction
See Fig. 4
Q Pulse Width < 300µs, Duty Cycle < 2% R Pins 2 and 3 externally tied together
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75LQ150
100
125°C
10
Reverse Current - I R ( mA )
100°C
1
75°C
1000
0.1
0.01
25°C
0.001
0.0001
Instantaneous Forward Current - I F (A)
0
40
80
120
160
100
Reverse Voltage - VR (V)
Fig. 2 - Typical Values of Reverse Current Vs. Reverse Voltage
10 Tj = 125°C Tj = 25°C Tj = -55°C
10000
1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Forward Voltage Drop - V F (V)
Junction Capacitance - CT (pF)
1000
T J = 25°C
Fig. 1 - Max. Forward Voltage Drop Characteristics
100 0 40 80 120 160
Reverse Voltage -VR (V)
Fig. 3 - Typical Junction Capacitance Vs. Reverse Voltage
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75LQ150
1
Thermal Response (Z thJC )
D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01
SINGLE PULSE (THERMAL RESPONSE)
0.01
0.001 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.1 0.0001 0.001 0.01
P DM t1 t2 1
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Max. Thermal Impedance Z thJC Characteristics
180 160
75LQ150
R thJC = 0.65°C/W
Allowable Case Temprature - (°C)
140 120
DC
100 80 60 40 20 0 0 20 40 60 80 100 120
Average Forward Current - I F(AV) (A)
Fig. 5 - Max. Allowable Case Temperature Vs. Average Forward Current
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 05/01
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