CR50TE-DLF Transistor Datasheet

CR50TE-DLF Datasheet, PDF, Equivalent


Part Number

CR50TE-DLF

Description

Wide-Viewing Angle CR 50 TE Photo Transistor

Manufacture

PerkinElmer Optoelectronics

Total Page 3 Pages
Datasheet
Download CR50TE-DLF Datasheet


CR50TE-DLF
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CERLED®
Ceramic Chip SMD
SMD – Wide-Viewing Angle
CR 50 TE Photo Transistor
Description
The solder pads provide an excellent heat
sink. For multi-sensors just choose 2 or more
CERLEDs. Clear epoxy lens.
Special Type (CR50TE-DLF) with daylight
filter on request.
Available on special order in 8 mm blister
tape or solid strips of up to 12 pcs with a true
pitch of 1.27 mm.
Features and Benefits
Solid state ceramic chip
Surface mounting device
High thermal conductivity
End - to - end and
side - to - side stackable
down to a pitch of 1.3 mm
Solder pads conform with
Mil-Std 883 B
www.optoelectronics.perkinelmer.com

CR50TE-DLF
Maximum Ratings at 25°C
Storage temperature
Operating temperature
Soldering temperature
Tst
Top
Tsold (10 s)
-25°C to 120°C
-25°C to 80°C
240° C
Optical and Electronic Characteristics at 25°C
Collector emitter breakdown voltage (VCE)
Dark current (ICEO)
Saturation voltage (VCEsat)
Wavelength of max. sensitivity (λ max)
Photo current rise / fall time (ton / toff)
Photosensitive area (A)
Power dissipation (Ptot)
Current gain (hFE)
min
40
1000
typ
900
4
0.18
200
max
400
0.3
1800
unit
V
nA
V
nm
µs
mm²
mW
conditions
I = 100 µA
VCE : 20V, EV : 0Lx
IC : 2 mA, Ib : 1000 µA
RL = 50 , f = 1 MHz
VCE = 5V, IB = 3 µA
Figure 1
Figure 2
Suggested Mounting Method
www.optoelectronics.perkinelmer.com
CERLED®
2


Features www.DataSheet4U.com CERLED® Ceramic Ch ip SMD SMD – Wide-Viewing Angle CR 50 TE Photo Transistor D A T A S H E E T Description The solder pads provide a n excellent heat sink. For multi-sensor s just choose 2 or more CERLEDs. Clear epoxy lens. Special Type (CR50TE-DLF) w ith daylight filter on request. Availab le on special order in 8 mm blister tap e or solid strips of up to 12 pcs with a true pitch of 1.27 mm. Features and Benefits Solid state ceramic chip Surfa ce mounting device High thermal conduct ivity End - to - end and side - to - si de stackable down to a pitch of 1.3 mm Solder pads conform with Mil-Std 883 B www. optoel ectronics. per kinelmer . com DATASHEET Maximum Ratings at 25° C Storage temperature Operating temper ature Soldering temperature Tst Top Tso ld (10 s) -25° C to 120° C -25° C to 80° C 240° C Optical and Electronic Characteristics at 25° C Collector em itter breakdown voltage (VCE) Dark curr ent (ICEO) Saturation voltage (VCEsat) Wavelength of max. sensitivity (λ .
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