Sweep Sensor. AT77C104B Datasheet

AT77C104B Sensor. Datasheet pdf. Equivalent


ATMEL Corporation AT77C104B
www.DataSheet4U.com
Features
Thermal Sensitive Layer Over a 0.35 µm CMOS Array
Image Zone: 0.4 x 11.6 mm
Image Array: 8 × 232 = 1856 Pixels
Pixel Pitch: 50 × 50 µm = 500 dpi Resolution
On-chip 8-bit Analog to Digital Converter
Serial Peripheral Interface (SPI) - 2 Modes:
– Fast Mode at 16 Mbps Max for Imaging
– Slow Mode at 200 kbps Max for Navigation and Control
Die Size: 1.5 × 15 mm
Operating Voltage: 2.3 to 3.6V
Operating Temperature Range: -40° C to 85° C
Finger Sweeping Speed from 2 to 20 cm/Second
Low Power: 4.5 mA (Image Acquisition), 1.5 mA (Navigation), <10 µA (Sleep Mode)
Hard Protective Coating (>4 Million Sweeps)
High Protection from Electrostatic Discharge
Small Form Factor Packaging
Description
This document describes the specifications of Atmel’s AT77C104B fingerprint sensor
dedicated to PDA, cellular and smartphone applications. Based on FingerChip ther-
mal technology, the AT77C104B is a linear sensor that captures fingerprint images by
sweeping the finger over the sensing area. This product embeds true hardware-based
8-way navigation and click functions.
Applications
• Scrolling, Menu and Item Selection for PDAs, Cellular or Smartphone Applications
• Cellular and Smartphones-based Security (Device Protection, Network and ISP
Access, E-commerce)
• Personal Digital Agenda (PDA) Access
• User Authentication for Private and Confidential Data Access
• Portable Fingerprint Acquisition
FingerChip®
Thermal
Fingerprint
Sweep Sensor,
Hardware
Based,
Navigation and
Click Function,
SPI Interface
AT77C104B
Chip-on-board Package
Sweep your finger
to make life easier
Actual size of sensor
5347B–BIOM–08/04


AT77C104B Datasheet
Recommendation AT77C104B Datasheet
Part AT77C104B
Description FingerChip Thermal Fingerprint Sweep Sensor
Feature AT77C104B; www.DataSheet4U.com Features • • • • • • • • • • • • • • Thermal Sensitive Layer Over a 0.35 µm CMO.
Manufacture ATMEL Corporation
Datasheet
Download AT77C104B Datasheet




ATMEL Corporation AT77C104B
Table 1. Pin Description for Chip-on-board Package: AT77C104B-CB08V
Pin Number Name
Type
Description
1 Not connected
2 Not connected
3 Not connected
4 Not connected
5
GNDD
G
Digital ground supply
6
GNDA
G
Analog ground supply - connect to GNDD
7
VDDD
P
Digital power supply
8
VDDA
P
Analog power supply - connect to VDD
9
SCK
I
Serial Port Interface (SPI) clock
10
TESTA
IO
Reserved for the analog test, not connected
11
MOSI
I
Master-out slave-in data
12 TPP P
Temperature stabilization power
13
MISO
O
Master-in slave-out data
14
SCANEN
I
Reserved for the scan test in factory, must be grounded
15 SSS I
Slow SPI slave select (active low
16 IRQ O
Interrupt line to host (active low). Digital test pin
17 FSS I
Fast SPI slave select (active low)
18 RST I
Reset and sleep mode control (active high)
19 FPL I
Front plane, must be grounded
Note: The die attach is connected to pin 6 and must be grounded. The FPL pin must also be grounded.
2 AT77C104B
5347B–BIOM–08/04



ATMEL Corporation AT77C104B
5347B–BIOM–08/04
AT77C104B
Figure 1. Typical Application
VDDD VDDD
10 k
10 k
IRQ
MISO
MOSI
SCK
SSS
FSS
SCANEN
GND
RST
TESTA
TPP
VDDD
GNDD
VDDA
GNDA
FPL
NC VDDD
10 µF
VDDA
10µF
GND
The pull-up must be implemented for the master controller. The noise should be lower
than 30 mV peak to peak on VDDA.
Figure 2. Pin Description
NC
NC
NC
NC
GNDD
GNDA
VDDD
VDDA
SCK
TESTA
MOSI
TPP
MISO
SCANEN
SSS
IRQ
FSS
RST
FPL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
The TESTA pin is only used for testing and debugging. The SCANEN pin is not used in
the final application and must be connected to ground.
Warning : SSS and FSS must never be low at the same time. When both SSS and FSS
equal 0, the chip switches to scan test mode. With the SPI protocol, this
configuration is not possible as only one slave at a time can be selected.
However, this configuration works when debugging the system.
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