AND8044D Thermal Performance Datasheet

AND8044D Datasheet, PDF, Equivalent


Part Number

AND8044D

Description

Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance

Manufacture

ON Semiconductor

Total Page 4 Pages
Datasheet
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AND8044D
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AND8044/D
Single-Channel 1206A
ChipFETt Power MOSFET
Recommended Pad Pattern
and Thermal Performance
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APPLICATION NOTE
INTRODUCTION
New ON Semiconductor ChipFETs in the leadless
1206A package feature the same outline as popular 1206A
resistors and capacitors but provide all the performance of
true power semiconductor devices. The 1206A ChipFET
has the same footprint as the body of the TSOP–6 and can
be thought of as a leadless TSOP–6 for purposes of
visualizing board area, but its thermal performance bears
comparison with the much large SO–8.
This technical note discusses the single–channel
ChipFET 1206A pin–out, package outline, pad patterns,
evaluation board layout and thermal performance.
PIN–OUT
Figure 1 shows the pin–out description and Pin 1
identification for the single–channel 1206A ChipFET
device. The pin–out is similar to the TSOP–6
configuration, with two additional drain pins to enhance
power dissipation and thermal performance. The legs of the
device are very short, again helping to reduce the thermal
path to the external heatsink/pcb and allowing a larger die
to be fitted in the device if necessary.
STYLE 1:
8 PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. GATE
5. SOURCE
1 6. DRAIN
7. DRAIN
8. DRAIN
Figure 1. Single 1206A ChipFET
BASIC PAD PATTERNS
The basic pad layout with dimensions is shown in
Figure 2. This is sufficient for low power dissipation
MOSFET applications, but power semiconductor
performance requires a greater copper pad area, particularly
for the drain leads.
The minimum recommended pad pattern, shown in
Figure 3, improves the thermal area of the drain
connections (pins 1, 2, 3, 6, 7, 8) while remaining within the
confines of the basic footprint. The drain copper area is
0.0054 sq. in. or 3.51 sq. mm. This will assist the power
dissipation path away from the device (through the copper
leadframe) and into the board and exterior chassis (if
applicable) for the single device. The addition of a further
copper area and/or the addition of vias to other board layers
will enhance the performance still further. An example of
this method is implemented on the Evaluation Board
described in the next section (Figure 4).
80 mil
28 mil
18 mil
1
2
3
4
8
25 mil
7
6
5
26 mil
Figure 2. Basic Pad Layout
80 mil
18
2 7 68 mil
36
26 mil
45
28 mil
Figure 3. Minimum Recommended Pad Pattern
© Semiconductor Components Industries, LLC, 2001
February, 2001 – Rev.0
1
Publication Order Number:
AN8044/D

AND8044D
AND8044/D
EVALUATION BOARD FOR THE SINGLE 1206A
The ChipFET 1206A evaluation board measures 0.6 in
by 0.5 in. Its copper pad pattern consists of an increased pad
area around the six drain leads on the top–side –
approximately 0.0482 sq. in. 31.1 sq. mm – and vias added
through to the underside of the board, again with a
maximized copper pad area of approximately the
board–size dimensions. The outer package outline is for the
8–pin DIP, which will allow test sockets to be used to assist
in testing.
The thermal performance of the 1206A on this board has
been measured with the results following on the next page.
The testing included comparison with the minimum
recommended footprint on the evaluation board–size pcb
and the industry standard one–inch square FR4 pcb with
copper on both sides of the board.
Front of Board
D
CCHhIPipFFEETTt
D
Back of Board
DD
DD
GS
1206A
Figure 4. Evaluation Board
THERMAL PERFORMANCE
Junction–to–Foot Thermal Resistance
(the Package Performance)
Thermal performance for the 1206A ChipFET measured
as junction–to–foot thermal resistance is 15_C/W typical,
20_C/W maximum for the single device. The “foot” is the
drain lead of the device as it connects with the body. This
is identical to the SO–8 package RθJF performance, a feat
made possible by shortening the leads to the point where
they become only a small part of the total footprint area.
Junction–to–Ambient Thermal Resistance
(dependent on pcb size)
The RθJA typical for the single–channel 1206A ChipFET
is 80_C/W steady state, compared with 68_C/W for the
SO–8. Maximum ratings are 95_C/W for the 1206–8
versus 80_C/W for the SO–8.
Testing
To aid comparison further, Figure 5 illustrates ChipFET
1206A thermal performance on two different board sizes
and three different pad patterns. The results display the
thermal performance out to steady state and produce a
graphic account of how an increased copper pad area for the
drain connections can enhance thermal performance. The
measured steady state values of RθJA for the single 1206A
ChipFET are:
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑMinimumrecommended pad pattern (see Figure 3)
on the evaluation board size of 0.5 in. x 0.6 in.
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑThe evaluation board with the pad pattern described
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑon Figure 4
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑIndustry standard 1square pcb with maximum
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑcopper both sides.
156_C/W
111_C/W
78_C/W
The results show that a major reduction can be made in
the thermal resistance by increasing the copper drain area.
In this example, a 45_C/W reduction was achieved without
having to increase the size of the board. If increasing board
size is an option, a further 33_C/W reduction was obtained
by maximizing the copper from the drain on the larger 1
square pcb.
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