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MAS1178 Dataheets PDF



Part Number MAS1178
Manufacturers Micro Analog systems
Logo Micro Analog systems
Description IC FOR 10.00 - 20.00 MHz VCXO
Datasheet MAS1178 DatasheetMAS1178 Datasheet (PDF)

www.DataSheet4U.com DA1178.006 13 July, 2006 MAS1178 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. IC FOR 10.00 – 20.00 MHz VCXO Low Power Wide Supply Voltage Range Square Wave Output Very High Level of Integration • Electrically Trimmable • Very Low Phase Noise • Low Cost • • • • To build a VCXO only one additional component, a crystal is needed. DESCRIPTION The MAS1178 is an integrated circ.

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www.DataSheet4U.com DA1178.006 13 July, 2006 MAS1178 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. IC FOR 10.00 – 20.00 MHz VCXO Low Power Wide Supply Voltage Range Square Wave Output Very High Level of Integration • Electrically Trimmable • Very Low Phase Noise • Low Cost • • • • To build a VCXO only one additional component, a crystal is needed. DESCRIPTION The MAS1178 is an integrated circuit well suited to build VCXO for mobile communication. The trimming is done by a serial bus and the calibration information is stored in an internal PROM. FEATURES • • • • • Very small size Minor current draw Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset Square wave output APPLICATIONS • • VCXO for mobile phones VCXO for other telecommunications systems BLOCK DIAGRAM MAS1178 VC OUT DA CLK PV VDD 6 Digital VSS X1 XO1 X2 1 (5) DA1178.006 13 July, 2006 PIN DESCRIPTION Pin Description Power Supply Voltage Serial Bus Clock Input Serial Bus Data Input Programming Input Voltage Control Input Crystal Oscillator Output Crystal/Varactor Oscillator Input Power Supply Ground Buffer Output Symbol VDD CLK DA PV VC X2 X1 VSS OUT x-coordinate 182 645 418 876 215 1053 434 617 1218 y-coordinate 1317 1329 1329 1311 213 209 209 2267 1329 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Note 1: Not valid for programming pin PV Symbol VDD - VSS VIN PMAX TOP TST Min -0.3 VSS -0.3 -35 -55 Max 6.0 VDD + 0.3 100 85 150 Unit V V mW o C o C Note 1) RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operable Temperature Storage Temperature Symbol VDD Idd TC TS Conditions Vdd = 2.8 Volt Relative humidity = 15%…70% -30 -5 Min 2.7 Typ 2.8 2.3 Max 5.5 +85 +40 Unit V mA o C o C 2 (5) DA1178.006 13 July, 2006 ELECTRICAL CHARACTERISTICS Parameter Frequency Range Voltage Control Range Voltage Control Sensitivity Output Voltage (10 pF, Vdd 2.7V) Output Voltage (10 pF, Vdd 5.0V) Rise and Fall Time (10-50pF) Output Symmetry Trimming CDAC (6 Bit) Startup Time CX1 TSTART C20 2 40-60 C20 + 12 Symbol fo VC VCSENS Vout Vout Min 10.00 0 30 2.3 4.5 10 Typ Max 20.00 Vdd ppm/V Vpp Vpp ns % pF ms 2) 1) Unit MHz Note Note 1: Vc sense is depending on the crystal used. Note 2: Typ. C20 = 5 pF IC OUTLINES VDD DA CLK PV OUT 1542 µm MAS1178 VC X1 VSS X2 Die map reference 1430 µm Note 1: MAS1178 pads are round with 80 µm diameter at opening. Note 2: Pins PV, CLK and DA must not be connected in VCXO module end-user application. 3 (5) DA1178.006 13 July, 2006 SAMPLES IN SB20 DIL PACKAGE 1 2 20 VDD 19 18 17 DA MAS1178 YYWW XXXXX.X VC 3 4 X1 5 GND 6 X2 7 8 9 10 16 CLK 15 14 13 12 PV 11 OUT Top marking: YYWW = Year, Week XXXXX.X = Lot number 4 (5) DA1178.006 13 July, 2006 ORDERING INFORMATION Product Code Product Package Comments Die size 1430 x 1542 µm Die size 1430 x 1542 µm MAS1178ATC1 IC FOR VCXO EWS tested wafers 400 µm MAS1178ATF1 IC FOR VCXO EWS tested wafers 254 µm MAS1178 IC FOR VCXO SMD Package T.B.D. Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 5 (5) .


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