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MC100E160 Dataheets PDF



Part Number MC100E160
Manufacturers Motorola
Logo Motorola
Description 12-Bit Parity Generator/Checker
Datasheet MC100E160 DatasheetMC100E160 Datasheet (PDF)

www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA 12ĆBit Parity Generator/Checker MC10E160 MC100E160 The MC10E/100E160 is a 12-bit parity generator/checker. The Q output is HIGH when an odd number of inputs are HIGH. A HIGH on the Enable input (EN) forces the Q output LOW. The E160 also features an output register. Multiplexers direct the register input, giving the option of holding present data by asserting HOLD LOW, or of shifting data in through the S-IN pin by asserting SHIFT HI.

  MC100E160   MC100E160


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www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA 12ĆBit Parity Generator/Checker MC10E160 MC100E160 The MC10E/100E160 is a 12-bit parity generator/checker. The Q output is HIGH when an odd number of inputs are HIGH. A HIGH on the Enable input (EN) forces the Q output LOW. The E160 also features an output register. Multiplexers direct the register input, giving the option of holding present data by asserting HOLD LOW, or of shifting data in through the S-IN pin by asserting SHIFT HIGH. The output register itself is clocked by a positive edge on CLK1 or CLK2 (or both). A HIGH on the reset pin (R) overrides to force the Y output LOW. 12-BIT PARITY GENERATOR/CHECKER • • • • • • • • Provides Odd-HIGH Parity of 12 Inputs Shiftable Output Register with Hold 900ps Max. D to Q/Q Output Enable Asynchronous Register Reset Dual Clocks Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D4 25 D5 D6 D7 26 27 28 1 2 3 4 5 6 7 8 9 10 11 D3 24 D2 23 D1 22 D0 21 EN 20 VCCO 19 18 17 16 15 14 13 12 Q Q VCC Y Y VCCO NC D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 EN HOLD Function Data Inputs Serial Data Input Enable, active LOW Hold, active LOW Shift, active HIGH Clock Inputs Reset Inputs Direct Output Register Output S-IN SHIFT CLK1 CLK2 R FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM VEE D8 D9 D10 Q D11 HOLD S-IN SHIFT CLK1 CLK2 R * All VCC and VCCO pins are tied together on the die. 0 MUX 1 SEL 0 MUX 1 SEL D R Y Y PIN NAMES Pin D0 – D11 S-IN EN HOLD SHIFT CLK1, CLK2 R Q, Q Y, Y 12/93 © Motorola, Inc. 1996 2–1 REV 2 MC10E160 MC100E160 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol IIH Characteristic Input HIGH Current CLK1, CLK2 R All Other Inputs Power Supply Current 10E 100E 82 82 min typ max 200 300 150 98 98 82 82 min 25°C typ max 200 300 150 98 98 82 94 min 85°C typ max 200 300 150 mA 98 113 Unit µA Condition IEE AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol tPLH tPHL Characteristic Propagation Delay to Output D to Q En to Q CLK to Y R to Y Setup Time D HOLD S-IN SHIFT Hold Time D HOLD S-IN SHIFT Rise/Fall Time 20 - 80% min 400 300 275 275 1200 600 350 500 – 400 100 300 200 300 typ 650 550 500 500 900 300 150 250 – 900 – 300 –150 – 250 450 650 max 950 750 700 725 min 400 300 275 275 1200 600 350 500 – 400 100 300 200 300 25°C typ 650 550 500 500 900 300 150 250 – 900 – 300 –150 – 250 450 650 max 950 750 700 725 min 400 300 275 275 1200 600 350 500 – 400 100 300 200 300 85°C typ 650 550 500 500 900 300 150 250 ps – 900 – 300 –150 – 250 ps 450 650 max 950 750 700 725 ps Unit ps Condition ts th tr tf 1. Within a device skew is guaranteed for identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E160 MC100E160 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) U T L –M M B -NY BRK M S N S S 0.007 (0.180) T L –M N S D Z -L-M- W 28 1 D X VIEW D-D G1 0.010 (0.250) S V T L –M S N S A Z R 0.007 (0.180) 0.007 (0.180) M T L –M T L –M S N N S H S 0.007 (0.180) M T L –M S N S M S C E G G1 0.010 (0.250) S K1 0.004 (0.100) J -TSEATING PLANE K F VIEW S 0.007 (0.180) M VIEW S T L –M S T L –M S N S N S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — ECLinPS and ECLinPS Lite DL140 — Rev 4 2–3 MOTOROLA MC10E160 MC100E160 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any.


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