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AAT8401 Dataheets PDF



Part Number AAT8401
Manufacturers AAT
Logo AAT
Description P-Channel Power MOSFET
Datasheet AAT8401 DatasheetAAT8401 Datasheet (PDF)

20V P-Channel Power MOSFET General Description The AAT8401 is a low threshold MOSFET designed for the battery, cell phone, and PDA markets. Using AnalogicTech™’s ultra high density proprietary TrenchDMOS™ technology, this product demonstrates high power handling and small size. AAT8401 Features • • • VDS(MAX) = -20V ID(MAX) 1 = -2.4A @ 25°C Low RDS(ON): • 100 mΩ @ VGS = -4.5V • 175 mΩ @ VGS = -2.5V Applications • • • Battery Packs Cellular & Cordless Telephones Battery-powered portable equipm.

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20V P-Channel Power MOSFET General Description The AAT8401 is a low threshold MOSFET designed for the battery, cell phone, and PDA markets. Using AnalogicTech™’s ultra high density proprietary TrenchDMOS™ technology, this product demonstrates high power handling and small size. AAT8401 Features • • • VDS(MAX) = -20V ID(MAX) 1 = -2.4A @ 25°C Low RDS(ON): • 100 mΩ @ VGS = -4.5V • 175 mΩ @ VGS = -2.5V Applications • • • Battery Packs Cellular & Cordless Telephones Battery-powered portable equipment SC59 Package Top View D 3 Preliminary Information 1 G www.DataSheet4U.com 2 S Absolute Maximum Ratings Symbol VDS VGS ID IDM IS PD TJ, TSTG (TA=25°C unless otherwise noted) Value -20 ±12 ±2.4 ±2.0 ±9 -0.9 1.0 0.6 -55 to 150 Description Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TJ=150°C 1 Units V TA = 25°C TA = 70°C 1 Pulsed Drain Current 2 Continuous Source Current (Source-Drain Diode) Maximum Power Dissipation 1 A TA = 25°C TA = 70°C W °C Operating Junction and Storage Temperature Range Thermal Characteristics Symbol RθJA RθJA2 RθJF Description Typical Junction-to-Ambient steady state 1 Maximum Junction-to-Ambient t<5 seconds Typical Junction-to-Foot 1 1 Value 145 125 50 Units °C/W °C/W °C/W 8401.2003.06.0.61 1 20V P-Channel Power MOSFET Electrical Characteristics Symbol Description (TJ=25°C unless otherwise noted) Conditions VGS=0V, ID=-250µA VGS=-4.5V, ID=-2.4A VGS=-2.5V, ID=-1.8A VGS=-4.5V, VDS=-5V (Pulsed) VGS=VDS, ID=-250µA VGS=±12V, VDS=0V VGS=0V, VDS=-20V VGS=0V, VDS=-16V, TJ=70°C 3 VDS=-5V, ID=-2.4A VDS=-15V, VDS=-15V, VDS=-15V, VDS=-15V, VDS=-15V, VDS=-15V, VDS=-15V, 2 AAT8401 Min -20 Typ Max Units V DC Characteristics BVDSS Drain-Source Breakdown Voltage RDS(ON) ID(ON) VGS(th) IGSS IDSS Drain-Source ON-Resistance On-State Drain Current 2 Gate Threshold Voltage Gate-Body Leakage Current Drain Source Leakage Current 2 88 146 -9 -0.6 100 175 mΩ A V nA µA S ±100 -1 -5 4 4 0.6 1.4 6.5 13 15 20 -1.3 -0.9 gfs Forward Transconductance 2 Dynamic Characteristics 3 QG Total Gate Charge QGS Gate-Source Charge QGD Gate-Drain Charge tD(ON) Turn-ON Delay tR Turn-ON Rise Time tD(OFF) Turn-OFF Delay tF Turn-OFF Fall Time Source-Drain Diode Characteristics VSD Source-Drain Forward Voltage IS Continuous Diode Current 1 RD=5.6Ω, RD=5.6Ω, RD=5.6Ω, RD=5.6Ω, RD=5.6Ω, RD=5.6Ω, RD=5.6Ω, VGS=-4.5V VGS=-4.5V VGS=-4.5V VGS=-4.5V, VGS=-4.5V, VGS=-4.5V, VGS=-4.5V, nC RG=6Ω RG=6Ω RG=6Ω RG=6Ω ns VGS=0, IS=-2.4A V A Note 1: Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5 second pulse on a 1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where the foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design, however RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design. Note 2: Pulse test: Pulse Width = 300 µs Note 3: Guaranteed by design. Not subject to production testing. 2 8401.2003.06.0.61 20V P-Channel Power MOSFET Typical Characteristics Output Characteristics 9 8 7 6 AAT8401 Transfer Characteristics 3V 2.5V ID (A) 9 8 7 6 5 4 3 2 5V 4.5V 4V 3.5V VD = VG -55°C 125°C 25°C IDS (A) 5 4 3 2 1 0 0 1 2 3 2V 1.5V 1 0 0 1 2 3 4 5 VDS (V) VGS (V) On-Resistance vs. Drain Current 300 250 On-Resistance vs. Gate to Source Voltage 300 250 ID = 2.7A RDS(ON) (mΩ) RDS(ON) (mΩ) 200 150 100 50 0 0 200 150 100 50 0 VGS = 2.5V VGS = 4.5V 2 4 6 8 0 1 2 3 4 5 ID (A) VGS (V) On-Resistance vs. Junction Temperature 1.6 Threshold Voltage 0.4 Normalized RDS(ON) VGS(th) Variance (V) 1.4 1.2 1.0 0.8 0.6 -50 VGS = 4.5V ID = 2.7A 0.3 0.2 0.1 0.0 -0.1 -0.2 ID = 250µA -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 TJ (°C) TJ (°C) 8401.2003.06.0.61 3 20V P-Channel Power MOSFET Typical Characteristics Gate Charge 5 4 3 2 1 0 0.1 0 0.2 0.4 0.6 0.8 1 1.2 AAT8401 Source-Drain Diode Forward Voltage 10 VD = 15V ID = 2.7A TJ = 150°C IS (A) 1 VGS (V) TJ = 25°C 0 1 2 3 4 5 QG, Charge (nC) VSD (V) Capacitance 750 600 450 300 150 0 0 -5 -10 -15 -20 30 25 Single Pulse Power, Junction to Ambient Capacitance (pF) Power (W) Ciss 20 15 10 5 0 0.001 Crss Coss 0.01 0.1 1 10 100 1000 VDS (V) Time (s) Transient Thermal Response, Junction to Ambient Normalized Effective Transient Thermal Impedance 10 1 0.1 0.2 0.5 0.1 Single Pulse .05 0.01 0.0001 0.001 .02 0.01 0.1 1 10 100 1000 Time (s) 4 8401.2003.06.0.61 20V P-Channel Power MOSFET Ordering Information Package SC59 Marking1 IGXYY Part Number (Tape and Reel) AAT8401IGY-T1 AAT8401 Note: Sample stock is generally held on all part numbers listed in BOLD. Note 1: XYY = assembly and date code. Package Information SC59 2.85 ± 0.15 1.575 ± 0.125 0.95 BSC 1.90 BSC 2.80 ± 0.20 0.075 ± 0.075 1.20 ± 0.30 .


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