Document
CEP02N7/CEB02N7 CEI02N7/CEF02N7
N-Channel Enhancement Mode Field Effect Transistor FEATURES
Type CEP02N7 CEB02N7 CEI02N7 CEF02N7 VDSS 700V 700V 700V 700V RDS(ON) 6.6Ω 6.6Ω 6.6Ω 6.6Ω ID 1.9A 1.9A 1.9A 1.9A e @VGS 10V 10V 10V 10V D
Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Lead free product is acquired. TO-220 & TO-263 & TO-262 package & TO-220F full-pak for through hole.
D
G
G D S
CEI SERIES TO-262(I2-PAK)
S CEB SERIES TO-263(DD-PAK)
G
G D S
CEP SERIES TO-220
G
D S
CEF SERIES TO-220F
S
ABSOLUTE MAXIMUM RATINGS
Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed
a
Tc = 25 C unless otherwise noted Limit Symbol TO-220/263/262 VDS VGS ID IDM PD EAS IAR EAR TJ,Tstg
f
TO-220F
Units V V
700
±30
1.9 6 60 0.48 125 2 5.4 -55 to 150 1.9 6
e e
A A W W/ C mJ A mJ C
Maximum Power Dissipation @ TC = 25 C - Derate above 25 C Single Pulsed Avalanche Energy d Repetitive Avalanche Current a Repetitive Avalanche Energy
a
32 0.26 125 2 5.4
Operating and Store Temperature Range
Thermal Characteristics
Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Symbol RθJC RθJA 2.1 62.5 Limit 3.9 65 Units C/W C/W
2004.October 4 - 10
http://www.cetsemi.com
CEP02N7/CEB02N7 CEI02N7/CEF02N7
Electrical Characteristics
Parameter Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse On Characteristics b Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Dynamic Characteristics Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics c Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage
b c
Tc = 25 C unless otherwise noted Symbol BVDSS IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS g VSD h VGS = 0V, IS = 2A VDS = 480V, ID = 2A, VGS = 10V VDD = 300V, ID = 2A, VGS = 10V, RGEN = 18Ω Test Condition VGS = 0V, ID = 250µA VDS = 700V, VGS = 0V VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VGS = VDS, ID = 250µA VGS = 10V, ID = 1A VDS = 50V, ID = 1A 2 5.5 0.7 250 50 30 19 26 34 15 14 2.5 8.6 1.9 1.5 35 50 70 40 20 Min 700 25 100 -100 4 6.6 Typ Max Units V
µA
4
nA nA V Ω S pF pF pF ns ns ns ns nC nC nC A V
VDS = 25V, VGS = 0V, f = 1.0 MHz
Drain-Source Diode Characteristics and Maximun Ratings
Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature . b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2% . c.Guaranteed by design, not subject to production testing. d.L =60mH, IAS =2.0A, VDD = 50V, RG = 25Ω, Starting TJ = 25 C . e.Limited only by maximum temperature allowed . f .Pulse width limited by safe operating area . g.Full package IS(max) = 1.4A . h.Full package VSD test condition IS = 1.5A , VSD(Max) = 1.6V .
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CEP02N7/CEB02N7 CEI02N7/CEF02N7
3.0 2.5 2.0 1.5 1.0 0.5 25 C 0.0 10 0 5 10 15 20 25
-1
ID, Drain Current (A)
ID, Drain Current (A)
TJ=150 C 10
0
-55 C 1.VDS=40V 2.Pulse Test 4 6 8 10
2
VDS, Drain-to-Source Voltage (V) Figure 1. Output Characteristics
300 250 200 150 100 Coss 50 0 0 5 10 15 20 25 Crss 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -100
VGS, Gate-to-Source Voltage (V) Figure 2. Transfer Characteristics
C, Capacitance (pF)
Ciss
RDS(ON), Normalized RDS(ON), On-Resistance(Ohms)
ID=1A VGS=10V
-50
0
50
100
150
200
VDS, Drain-to-Source Voltage (V) Figure 3. Capacitance
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50
TJ, Junction Temperature( C) Figure 4. On-Resistance Variation with Temperature
1
VTH, Normalized Gate-Source Threshold Voltage
VDS=VGS ID=250µA
IS, Source-drain current (A)
10
VGS=0V
10
0
10 -25 0 25 50 75 100 125 150
-1
0.4
0.6
0.8
1.0
1.2
TJ, Junction Temperature( C) Figure 5. Gate Threshold Variation with Temperature
VSD, Body Diode Forward Voltage (V) Figure 6. Body Diode Forward Voltage Variation with Source Current
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CEP02N7/CEB02N7 CEI02N7/CEF02N7
VGS, Gate to Source Voltage (V)
15 VDS=480V ID=2A 10
1
10µs
ID, Drain Current (A)
12
RDS(ON)Limit 10
0
4
1ms 10ms DC
9
6
10
-1
3
0 0 5 10 15 20
10
-2
TC=25 C TJ=150 C Single Pulse 10
0
10
1
10
2
10
3
Qg, Total Gate Charge (nC) Figure 7. Gate Charge
VDS, Drain-Source Voltage (V) Figure 8. Maximum Safe Operating Area
VDD t on V IN D VGS RGEN G
90%
toff tr
90%
RL VOUT
td(on) VOUT
td(off)
90% 10%
tf
10%
INVERTED
S
VIN
50% 10%
50%
PULSE WIDTH
Figure 9. Switching Test Circuit
Figure 10. Switching Waveforms
r(t),Normalized Effective Transient Thermal Impedance
10
0
D=0.5 0.2 0.1
10
-1
PDM 0.05 0.02 0.01 t1 t2 1. R£cJC (t)=r (t) * R£cJC 2. R£cJC=See Datasheet 3. TJM-TC = P* R£cJC (t) 4. Duty Cycle, D=t1/t2
10
-2
Single Pulse
-5
10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Square Wave .