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RMPA1766

Fairchild Semiconductor

WCDMA Band IV Power Amplifier Module

PRELIMINARY RMPA1766 i-Lo™ WCDMA Band IV Power Amplifier Module April 2007 RMPA1766 i-Lo™ WCDMA Band IV Power Amplifier...


Fairchild Semiconductor

RMPA1766

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Description
PRELIMINARY RMPA1766 i-Lo™ WCDMA Band IV Power Amplifier Module April 2007 RMPA1766 i-Lo™ WCDMA Band IV Power Amplifier Module Features ■ 40% WCDMA efficiency at +28dBm Pout ■ 20% WCDMA efficiency (58mA total current) at tm General Description The RMPA1766 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA1766 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier efficiency. Further, the 4 x 4 x 1.0 mm LCC package is pin-compatible and a drop-in replacement for last generation 4 x 4 mm PAMs widely used today, minimizing the design time to apply this performance-enhancing technology. The multi-stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fairchild RF’s InGaP Heterojunction Bipolar Transistor (HBT) process. +16dBm Pout ■ Low quiescent current (Iccq): 25mA in low-power mode ■ Meets HSDPA performance requirem...




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