P0406FCxxC

05155 P0406FC3.3C* thru Only One Name Means ProT ek’Tion™ P0406FC36C* FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPA TIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 3 to 5 Lines ✔ RoHS in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0406 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Plating ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURA TION 0406 (Single Chip Shown) *U.S. Patent No. Des. “D456,367S” 05155.R4 3/05 1 www.protekdevices.com P0406FC3.3C* thru P0406FC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 250 -55°C to 150°C -55°C to 150°C UNITS Watts °C °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) RATED STAND-O...