HEXFET Power MOSFET
PD - 94662
IRLR7807Z IRLU7807Z
Applications High Frequency Synchronous Buck Converters for Computer Processor Power Ben...
Description
PD - 94662
IRLR7807Z IRLU7807Z
Applications High Frequency Synchronous Buck Converters for Computer Processor Power Benefits Very Low RDS(on) at 4.5V VGS Ultra-Low Gate Impedance Fully Characterized Avalanche Voltage and Current
HEXFET® Power MOSFET
VDSS RDS(on) max Qg (typ.)
30V 13.8mΩ 7.0nC
D-Pak IRLR7807Z
I-Pak IRLU7807Z
Absolute Maximum Ratings
Parameter
VDS VGS ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C PD @TC = 100°C TJ TSTG Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Maximum Power Dissipation Maximum Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case)
Max.
30 ± 20 43 30 170 40 20 0.27 -55 to + 175
Units
V
A W
W/°C °C
Thermal Resistance
Parameter
RθJC RθJA RθJA Junction-to-Case Junction-to-Ambient (PCB Mount) Junction-to-Ambient
Typ.
––– ––– –––
Max.
3.75 50 110
Units
°C/W
Notes
through
are on page 11
www.irf.com
1
4/7/03
IRLR/U7807Z
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS ∆ΒVDSS/∆TJ RDS(on) VGS(th) ∆VGS(th)/∆TJ IDSS IGSS gfs Qg Qgs1 Qgs2 Qgd Qgodr Qsw Qoss td(on) tr td(off) tf Ciss Coss Crss Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source...
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