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UPD780144A Dataheets PDF



Part Number UPD780144A
Manufacturers NEC
Logo NEC
Description (UPD78014x) 8-bit single-chip microcontroller
Datasheet UPD780144A DatasheetUPD780144A Datasheet (PDF)

User’s Manual 78K0/KF1 8-Bit Single-Chip Microcontrollers www.DataSheet4U.com µPD780143 µPD780144 µPD780146 µPD780148 µPD78F0148 µPD780143(A) µPD780144(A) µPD780146(A) µPD780148(A) µPD78F0148(A) µPD780143(A1) µPD780144(A1) µPD780146(A1) µPD780148(A1) µPD78F0148(A1) µPD780143(A2) µPD780144(A2) µPD780146(A2) µPD780148(A2) Document No. U15947EJ2V0UD00 (2nd edition) Date Published September 2003 N CP(K) © Printed in Japan [MEMO] www.DataSheet4U.com 2 User’s Manual U15947EJ2V0UD NOTES FO.

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User’s Manual 78K0/KF1 8-Bit Single-Chip Microcontrollers www.DataSheet4U.com µPD780143 µPD780144 µPD780146 µPD780148 µPD78F0148 µPD780143(A) µPD780144(A) µPD780146(A) µPD780148(A) µPD78F0148(A) µPD780143(A1) µPD780144(A1) µPD780146(A1) µPD780148(A1) µPD78F0148(A1) µPD780143(A2) µPD780144(A2) µPD780146(A2) µPD780148(A2) Document No. U15947EJ2V0UD00 (2nd edition) Date Published September 2003 N CP(K) © Printed in Japan [MEMO] www.DataSheet4U.com 2 User’s Manual U15947EJ2V0UD NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. www.DataSheet4U.com 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. TRON is an abbreviation of The Realtime Operating system Nucleus. ITRON is an abbreviation of Industrial TRON. User’s Manual U15947EJ2V0UD 3 These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. www.DataSheet4U.com • The information in this document is current as of April, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third.


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