Features
• Low Forward Voltage Drop • Guard Ring Die Construction for Transient Protection • Ideal for low logic level a...
Features
Low Forward Voltage Drop Guard Ring Die Construction for Transient Protection Ideal for low logic level applications Low Capacitance Lead Free by Design/RoHS Compliant (Note 1) "Green" Device, Note 4 and 5 Qualified to AEC-Q101 Standards for High Reliability
SDM03U40
SURFACE MOUNT
SCHOTTKY BARRIER DIODE
Mechanical Data
Case: SOD-523 Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminal Connections: Cathode Band Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208 Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.002 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Peak Reverse Voltage DC Reverse Voltage RMS Reverse Voltage Average Rectified Current Non-Repetitive Peak Forward Surge Current @8.3ms Single half sine-wave superimposed on rated load
Symbol VRM VR
VR(RMS) IO
IFSM
Value 40 30 21 30
200
Unit V V V mA
mA
Thermal Characteristics
Characteristic Power Dissipation (Note 2) Thermal Resistance, Junction to Ambient (Note 2) Operating and Storage Temperature Range
Symbol PD RθJA
TJ, TSTG
Value 150 667
-40 to +125
Unit mW °C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Reverse Breakdown Voltage (Note 3) Forward Voltage Peak Reverse Current (Note 3) Total Capa...