GaAs MMIC Power Amplifier
2.0-22.0 GHz GaAs MMIC Power Amplifier
August 2006 - Rev 02-Aug-06
CMM0014-BD
Chip Diagram
2.0 to 22.0 GHz GaAs MMIC P...
Description
2.0-22.0 GHz GaAs MMIC Power Amplifier
August 2006 - Rev 02-Aug-06
CMM0014-BD
Chip Diagram
2.0 to 22.0 GHz GaAs MMIC Power Amplifier
Advanced Product Information August 2004
(1 of 3)
Features Small Size: 45 x 92 mils High Gain: 11.5 dB, Nom Medium Power: +25 dBm, Typ P1dB @14 GHz Directly Cascadable – Fully Matched Unconditionally Stable Single Bias Operation Bias Control pHEMT Technology Silicon Nitride Passivation Specifications (TA = 25°C, Vdd = 8V)1
Parameters
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Units
Min
Typ
Max
Frequency Range Small Signal Gain Gain Flatness Gain Variation (-40°C to +85°C) Input Return Loss Output Return Loss Power Output (@1 dB Gain Compression) 1 P1dB Variation (over operating frequency) P1dB Variation (-40°C to +85°C) Saturated Output Power Second Order Intercept Point @ 10 GHz Third Order Intercept Point @ 10 GHz Noise Figure Current Thermal Resistance Stability 2
GHz dB ±dB ±dB dB dB dBm dBm ±dBm dBm dBm dBm dB mA °C/W
2.0 10.0
22.0 13.5 0.8 0.35 -10.0 -9.0
22.5 4.5 0.25 29.0 48.0 37.5 250 Unconditionally Stable 295 7.5 340 33.0
24.0
Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 3). 2. Stability factor measured on-wafer.
Absolute Maximum Ratings
Parameter Rating
Die Attach and Bonding Procedures
7V (min.) / 9V (max.) 350 mA 2.8 W +20 dBm -50°C to +150°C +175°C -40 to (see note 2)°C
Die Attach: Eutectic die attach is recommended. For eutectic die attach: Preform: AuSn (80% Au, 20% Sn); Sta...
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