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IRF6716MTRPBF Dataheets PDF



Part Number IRF6716MTRPBF
Manufacturers International Rectifier
Logo International Rectifier
Description N-Channel HEXFET Power MOSFET
Datasheet IRF6716MTRPBF DatasheetIRF6716MTRPBF Datasheet (PDF)

IRF6716MPbF IRF6716MTRPbF l l l l l l l l l l PD - 97274 RoHs Compliant Containing No Lead and Bromide  VDSS VGS RDS(on) RDS(on) Low Profile (<0.6 mm) 25V max ±20V max 1.2mΩ@10V 2.0mΩ@ 4.5V Dual Sided Cooling Compatible  Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) Ultra Low Package Inductance 39nC 12nC 5.3nC 28nC 27nC 1.9V Optimized for High Frequency Switching  Ideal for CPU Core DC-DC Converters Optimized for Sync. FET socket of Sync. Buck Converter Low Conduction and Switching Losses Compatible wi.

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IRF6716MPbF IRF6716MTRPbF l l l l l l l l l l PD - 97274 RoHs Compliant Containing No Lead and Bromide  VDSS VGS RDS(on) RDS(on) Low Profile (<0.6 mm) 25V max ±20V max 1.2mΩ@10V 2.0mΩ@ 4.5V Dual Sided Cooling Compatible  Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) Ultra Low Package Inductance 39nC 12nC 5.3nC 28nC 27nC 1.9V Optimized for High Frequency Switching  Ideal for CPU Core DC-DC Converters Optimized for Sync. FET socket of Sync. Buck Converter Low Conduction and Switching Losses Compatible with existing Surface Mount Techniques  100% Rg tested MX DirectFET™ ISOMETRIC Typical values (unless otherwise specified) DirectFET™ Power MOSFET ‚ Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details) SQ SX ST MQ MX MT MP Description The IRF6716MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6716MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of www.DataSheet4U.com processors operating at higher frequencies. The IRF6716MPbF has been optimized for parameters that are critical in synchronous buck including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6716MPbF offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications. Absolute Maximum Ratings Parameter VDS VGS ID @ TA = 25°C ID @ TA = 70°C ID @ TC = 25°C IDM EAS IAR 6 Typical RDS(on) (mΩ) Max. Units V Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Single Pulse Avalanche Energy Avalanche Current g e e f Ãg h VGS, Gate-to-Source Voltage (V) 25 ±20 39 31 180 320 330 32 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0 10 20 30 40 50 ID= 32A V = 20V DS VDS= 13V A mJ A 5 4 3 2 1 0 2 3 4 5 6 7 8 T J = 25°C T J = 125°C ID = 40A 9 10 60 VGS, Gate -to -Source Voltage (V) Notes:  Click on this section to link to the appropriate technical paper. ‚ Click on this section to link to the DirectFET Website. ƒ Surface mounted on 1 in. square Cu board, steady state. Fig 1. Typical On-Resistance vs. Gate Voltage QG Total Gate Charge (nC) Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage „ TC measured with thermocouple mounte.


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