PUSH-PULL AMPLIFIER. MC-7832 Datasheet


MC-7832 AMPLIFIER. Datasheet pdf. Equivalent


MC-7832


(MC-7831 - MC-7833) GaAs CATV PUSH-PULL AMPLIFIER
MC-7831 NEC's 870 MHz GaAs CATV MC-7832 PUSH-PULL AMPLIFIER MC-7833
FEATURES
• GaAs ACTIVE DEVICES • LOW DISTORTION • HIGH LINEAR GAIN: MC-7831 - GL = 18 dB MIN at f = 870 MHz MC-7832 - GL = 22 dB MIN at f = 870 MHz MC-7833 - GL = 25 dB MIN at f = 870 MHz • LOW RETURN LOSS • LOW GAIN CHANGE OVER TEMPERATURE • SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE • HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.)

OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
45.08 MAX 38.1±0.25 3.2 MAX 27.5 MAX 4.25
+ 0.25 - 0.35

14.85 MAX 4.0±0.25 8.1 MAX 19.05±0.38 6-32 unc 2B 0.51±0.050 21.5 MAX 1 In

VDD 5 9 Out

25.4±0.25 2.54±0.25

2 3 7 8 Gnd

12.9 MAX

1 2 3 5

7 8 9

2.62–0.35

10.75±0.25

DESCRIPTION
NEC's MC-7831, MC-7832, and MC-7833 are GaAs MultiChip Modules designed for use as input stages in CATV applications up to 870 MHz. The only difference between these devices is gain, which is 18 dB, 22 dB, and 25 dB respectively. Because these units are GaAs devices they have low www.DataSheet4U.com distortion, low noise figure, and low return loss across the entire frequency band. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using full...



MC-7832
NEC's 870 MHz GaAs CATV
PUSH-PULL AMPLIFIER
MC-7831
MC-7832
MC-7833
FEATURES
• GaAs ACTIVE DEVICES
• LOW DISTORTION
• HIGH LINEAR GAIN:
MC-7831 - GL = 18 dB MIN at f = 870 MHz
MC-7832 - GL = 22 dB MIN at f = 870 MHz
MC-7833 - GL = 25 dB MIN at f = 870 MHz
LOW RETURN LOSS
LOW GAIN CHANGE OVER TEMPERATURE
SPECIFIED FOR 79, 110, and 132 CHANNELS
PERFORMANCE
HIGH RELIABILITY AND RUGGEDNESS:
Withstands environmental extremes as well as Silicon
devices (Surge, ESD, Etc.)
DESCRIPTION
NEC's MC-7831, MC-7832, and MC-7833 are GaAs Multi-
Chip Modules designed for use as input stages in CATV ap-
plications up to 870 MHz. The only difference between these
devices is gain, which is 18 dB, 22 dB, and 25 dB respec-
tively. Because these units are GaAs devices they have low
www.DataSheet4U.codmistortion, low noise figure, and low return loss across the entire
frequency band.
Like the previous generation of products, these devices sur-
vive such hazards as surge and ESD as well as their silicon
competitors, but deliver superior performance with low DC
current required. All devices are assembled and tested using
fully automated equipment to maximize consistency in part to
part performance, and reliability is assured by NEC's strin-
gent quality and process control procedures. These parts come
in industry compatible hybrid packages.
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
3.2 MAX
14.85 MAX
8.1 MAX
45.08 MAX
38.1±0.25
27.5 MAX
19.05±0.38
25.4±0.25
2.54±0.25
12 3 5 789
4.19±0.13 A
0.38.. A
4.25
+
-
0.25
0.35
4.0±0.25
6-32 unc 2B
21.5 MAX
6.3 2.5
±0.05
VDD
5
19
In Out
2 378
0.51±0.050
Gnd
10.75±0.25
2.54±0.38
APPLICATIONS
• CATV HEADEND SYSTEMS
• CATV OPTICAL NODES
• CATV DISTRIBUTION AMPS
ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 )
SYMBOLS
BW
GL
S
Gf
NF
RL
IDD
CTB
XMod
CSO
PART NUMBER
CHARACTERISTICS
Frequency Range
Linear Gain
Gain Slope
Gain Flatness
Noise Figure 1
Noise Figure 2
Input/Output Return Loss
Operating Current
Composite Triple Beat
Cross Modulation1dBc
Composite Second Order
UNITS
MHz
dB
dB
dB
dB
dB
mA
dBc
dBc
dBc
MC-7831
MIN TYP MAX
50 – 870
18.0 – 19.0
0.2 – 1.0
– – 0.7
MC-7832
MIN TYP MAX
50 – 870
22.0 – 23.0
0.6 – 1.4
– – 0.7
MC-7833
MIN TYP MAX
50 – 870
25.0 – 26.0
1.0 – 1.8
– – 0.7
– – 6.5 – – 6.0 – – 5.5
– – 7.0 – – 6.5 – – 6.0
20.0 – – 20.0 – – 20.0 – –
19.0 – – 19.0 – – 19.0 – –
17.5 – – 17.5 – – 17.5 – –
16.0 – – 16.0 – – 16.0 – –
180 – 240 180 – 240 180 – 240
– -59 -57 – -59 -57 – -59 -57
– -51 -50 – -53 -50 – -53 -50
– -63 -57 – -60 -57 – -61 -57
TEST CONDITIONS
f = 870 MHz
f = 40 to 870 MHz
40 to 870 MHz;
Peak to Valley
f = 50 MHz
f = 870 MHz
40 to 160MHz
160 to 320 MHz
320 to 640 MHz
640 to 870 MHz
RF OFF
f = 40 to 870 MHz
110 Channels,
VOUT = 44 dBmV, Flat
1. Measured per US standard methods and procedures (using selective level meter).
California Eastern Laboratories

MC-7832
MC-7831, 7832, 7833
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
PARAMETERS
UNITS RATINGS
VDD Supply Voltage
V 30
VI Input Voltage2
dBmV
65
TC Operating Case Temperature °C -30 to +100
TSTG
Storage Temperature
°C -40 to +100
Note:
1. Operation in excess of any one of these parameters may result in
permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75)
SYMBOLS PARAMETERS
UNITS MIN TYP MAX
VDD Supply Voltage, MC-7831 V 23.5 24.0 24.5
MC-7832
23.5 24.0 24.5
MC-7833
23.5 24.0 24.5
Vi Input Voltage1, MC-7831 dBmV – 21.0 27.5
MC-7832
– 21.0 27.5
MC-7833
– 19.0 25.5
TC Operating Case, MC-7831 °C -30 +25 +85
Temperature MC-7832
-30 +25 +85
MC-7833
-30 +25 +85
Note:
1. Test Conditions: 110 Channels, Flat
ORDERING INFORMATION
PART NUMBER
PACKAGE
QUANTITY
MC-7831-AZ 7-pin special with heatsink 50pcs max/ Tray
MC-7832-AZ 7-pin special with heatsink 50pcs max/ Tray
MC-7833-AZ 7-pin special with heatsink 50pcs max/ Tray
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be
kept more than 1 mm to prevent undesired stress on the lead and
also should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales
representatives.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating
Pin area temperature: less
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
07/08/2003
A Business Partner of NEC Compound Semiconductor Devices, Ltd.




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