ESH1PD

ESH1PA thru ESH1PD New Product Vishay Semiconductors formerly General Semiconductor High Current Density Surface Mount Ultrafast Rectifiers Cas Style SMP Cathode band Features Reverse Voltage 50 to 200 V Forward Current 1.0 A Reverse Recovery Time 25ns 0.086 (2.18) 0.074 (1.88) 0.142 (3.61) 0.126 (3.19) 0.158 (4.00) 0.146 (3.70) Very low profile - typical height of 1.0mm For surface mount application Glass passivated chip junction Ultrafast recovery times for high efficiency Low forward voltage, low power loss High operation temperature up to 175°C Built-in strain relief, ideal for automated placement High temperature soldering guaranteed: 260°C/10 seconds at terminals Meets MSL Level 1 per J-STD-020C Dimensions in inches and (millimeters) 0.045 (1.15) 0.033 (0.85) Mechanical Data Case: SMP Terminals: Matte Tin plated (E3 Suffix) leads, solderable per J-STD-002B and MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.0009 oz., 0.024g Epoxy meets UL 94V-0 flammability rating 0.013 (0.35) 0.004 (0.10) 0.012 (0.30) 0.000 (0.00) 0.018 (0.45) 0.006 (0.15) Mounting Pad Layout 0.012 (0.30) REF 0.105 (2.67) 0.025 (0.635) 0.030 (0.762) www.DataSheet4U.com 0.053 (1.35) 0.041 (1.05) 0.036 (0.91) 0.024 (0.61) 0.100 (2.54) 0.050 (1.27) 0.103 (2.60) 0.087 (2.20) 0.032 (0.80) 0.016 (0.40) Maximum Ratings & Thermal Characteristics (T Parameter Device marking code Maximum reverse voltage Maximum average forward rectified current Fi...