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Pin Diode. HVL145 Datasheet |
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HVL145
Silicon Epitaxial Planar Pin Diode for Antenna Switching
REJ03G0434-0100
(Previous: ADE-208-1597)
Rev.1.00
Dec 07, 2004
Features
• An optimal solution for antenna switching in mobile phones.
• Low capacitance. (C = 0.45 pF max)
• Low forward resistance. (rf = 1.8 Ω max)
• Extremely small Flat Lead Package (EFP) is suitable for surface mount design.
Ordering Information
Type No.
HVL145
Laser Mark
4
Package Code
EFP
Pin Arrangement
www.DataSheet4U.com
Cathode mark
Mark
12
1. Cathode
2. Anode
Rev.1.00, Dec 07, 2004, page 1 of 5
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HVL145
Absolute Maximum Ratings
Item
Reverse voltage
Forward current
Power dissipation
Junction temperature
Storage temperature
VR
IF
Pd
Tj
Tstg
Symbol
Value
60
50
100
125
−55 to +125
(Ta = 25°C)
Unit
V
mA
mW
°C
°C
Electrical Characteristics
(Ta = 25°C)
Item
Symbol
Min
Typ
Max Unit
Test Condition
Reverse current
Forward voltage
Capacitance
Forward resistance
ESD-Capability *1
IR
VF
C
rf
—
— — 100 nA VR = 60 V
— — 0.9 V IF = 2 mA
—
—
0.45
pF VR = 1 V, f = 1 MHz
— — 1.8 Ω IF = 10 mA, f = 100 MHz
100 —
— V C = 200 pF, R = 0 Ω, Both forward
and reverse direction 1 pulse.
Notes: 1. Failure criterion; IR > 100 nA at VR = 60 V
2. Please do not use the soldering iron due to avoid high stress to the EFP package.
3. The material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as
unquestioned. Please kindly consider soldering nature.
Rev.1.00, Dec 07, 2004, page 2 of 5
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