MA4DP918-1277

HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 Features n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Required Low Cost Miniature Plastic MLP Package TM Description The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium. The glass allows HMIC devices to have excellent Q characteristics in a low profile, reliable device. Conductors are printed with state-of-the-art semiconductor photolithography processes and encapsulated in rugged silicon nitride and BCB polyamide. The circuit is composed of plated inductors and metal-insulator-metal (MIM) capacitors employing a silicon nitride dielectric layer. The high performance 3 mm MLP package allows for surface mount placement with no additional circuit matching required. PIN Configuration PIN Function GND NC RF 900 NC NC NC NC NC Paddle PIN 9 10 11 12 13 14 15 16 GND Function NC RF 1800 NC GND NC ANT NC NC 1 2 3 4 5 6 www.DataSheet4U.com Applications The MA4DP918-1277 HMICTM Integra...