Wirewound Chip Inductors
Wirewound Chip Inductors
FEATURES
• • • • • SIZES K(0402), J (0603), D (0805) AND C (1008) HIGH Q, HIGH CURRENT AND HIGH...
Description
Wirewound Chip Inductors
FEATURES
SIZES K(0402), J (0603), D (0805) AND C (1008) HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS includes all homogeneous materials BOTH FLOW AND REFLOW SOLDERING APPLICABLE* *See Part Number System for Details HIGH INDUCTANCE AVAILABLE IN SMALL SIZE EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
Case Size Code 0603 (J) 0805 (D) 1008 (C) 1.8nH ~ 270nH 2.2nH ~ 910nH 10nH ~ 4.7µH ±2% (G), ±5% (J), ±10% (K), ±20% (M) -40°C ~ +125°C
NIN-H Series
RoHS Compliant
*FLOW & REFLOW SOLDERING 0805 & 1008 SIZES, 0402 & 0603 REFLOW SOLDERING ONLY
Specifications Inductance Range Inductance Tolerance Operating Temperature Range
0402 (K) 1.0nH ~ 68nH ±0.3nH (S), ±5% (J)
ENVIRONMENTAL CHARACTERISTICS
Specifications 75% Min. Coverage (1) No evidence of damage (2) Inductance change ±5% of initial value Resistance to Soldering Heat (3) Q factor within ±10% of initial value (±20% for 0402 & 0603 case sizes) Humidity Low Frequency Vibration Thermal Shock Low Temperature Storage (1) No evidence of damage (2) Inductance change ±5% of initial value (±10% for 0402 case size) (3) Q factor within ±10% of initial value (±20% for 0402 & 0603 case sizes) (1) No evidence of damage (2) Inductance change ±10% of initial value (±20% for 0402 case size) (3) Q factor within ±10% of initial value (±20% for 0402 & 0603 case sizes) No evidence of short or open circuit Test Solderability Test Method & Condition After 3 sec. dip in +230°C soldering pot (post flux)...
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