MA4P7461F-1072T

www.DataSheet4U.com Non Magnetic SMQ HIPAX PIN Diode Features Non-Magnetic Package Suitable for MRI Applications Rectangular MELF SMQ Ceramic Package Hermetically Sealed Lower Rs for Lower Series Loss n Longer τ L for Lower Intermodulation Distortion n Lower Cj for Higher Series Isolation n Higher Average Incident Power Handling Capability n n n n V 2.00 MA4P7461F-1072T Description The MA4P7461F-1072T is a surface mountable PIN diode in a Non-Magnetic ( patent pending ) Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM’s new nonmagnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN diode that is full face bonded on both the cathode and anode of the chip to maximize surface area for lower electrical and thermal resistance. The MA4P7461F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. Designed for Automated Assembly These SMQ PIN diodes are designed for high volume tape and reel assembly. The rectangular package design provides for highly efficient automatic pick and place assembly techniques. The parallel flat surfaces are suitable for key jaw or vacuum pickup techniques. All solder able surfaces are tin plated and compatible with reflow and vap...