Diode Switch. MASW-004100-1193 Datasheet

MASW-004100-1193 Switch. Datasheet pdf. Equivalent

Part MASW-004100-1193
Description Monolithic PIN SP4T Diode Switch
Feature www.DataSheet4U.com Monolithic PIN SP4T Diode Switch MASW-004100-1193 Rev. 2 Features • • • • Ult.
Manufacture Tyco Electronics
Datasheet
Download MASW-004100-1193 Datasheet



MASW-004100-1193
www.DataSheet4U.com
Monolithic PIN SP4T Diode Switch
MASW-004100-1193
Rev. 2
Features
Ultra Broad Bandwidth: 50MHz to 26GHz
0.9 Insertion Loss , 34dB Isolation at 20GHz
50nS Switching Speed
Reliable, Fully Monolithic, Glass Encapsulated
Construction
Description
The MASW-004100-1193 is a SP4T series-shunt
broad band switch made with M/A-COM’s unique
HMICTM (Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series and
shunt diodes or vias by imbedding them in a low loss,
low dispersion glass. This hybrid combination of silicon
and glass gives HMIC switches exceptional low loss
and remarkable high isolation through low millimeter-
wave frequencies.
Applications
These high performance switches are suitable for use
in multi-band ECM, radar, and instrumentation control
circuits where high isolation to insertion loss ratios are
required. With a standard +5V/-5V, TTL controlled PIN
diode driver, 50nS switching speeds are achieved.
Absolute Maximum Ratings
TAMB = +25°C ( Unless Otherwise Specified )
Parameter
Operating Temperature
Storage Temperature
RF C.W. Incident Power (± 20mA)
Bias Current ( Forward )
Applied Voltage ( Reverse )
Value
-65°C to +125°C
-65°C to +150°C
+33dBm
± 20mA
-25 Volts
Notes:
Exceeding these limits may cause permanent
damage.
J2
J3 J4
J5
J1
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MASW-004100-1193
Monolithic Pin Diode Series-Shunt Switch
MASW-004100-1193
Rev 2
Electrical Specifications @ TAMB = +25oC, ± 20mA Bias Current (On-Wafer Measurements)
Parameter
Frequency
Minimum
Nominal
Maximum
Units
Insertion Loss
20 GHz
0.9 1.3 dB
Isolation
20 GHz
28
34
dB
Input Return Loss
20 GHz
15 dB
Output Return Loss
20 GHz
15 dB
Switching Speed1
10 GHz
50 nS
Notes:
1.) Typical switching speed is measured from 10% to 90% of detected RF voltage driven by a TTL compatible driver. Driver output
parallel RC network uses a capacitor between 390pF – 560pF and a resistor between 150– 220to achieve 50nS
rise and fall times.
Typical Driver Connections
Control Level ( DC Current ) at Port
J2
-20mA
+20mA
+20mA
+20mA
J3
+20mA
-20mA
+20mA
+20mA
J4
+20mA
+20mA
-20mA
+20mA
J5
+20mA
+20mA
+20mA
-20mA
Condition of
RF Output
J1-J2
Low Loss
Isolation
Isolation
Isolation
Condition of
RF Output
J1-J3
Isolation
Low Loss
Isolation
Isolation
Condition of
RF Output
J1-J4
Isolation
Isolation
Low Loss
Isolation
Condition of
RF Output
J1-J5
Isolation
Isolation
Isolation
Low Loss
Assembly Considerations
Cleanliness
Chips should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MASW-004100-1193 PIN switch is ESD, Class 1A sensitive (HBM). Proper ESD handling equipment and
procedures should be used.
Die Wire Bonding
Thermosonic wedge wire bonding using ¼ x 3 mil sq. ribbon or Ball Bonding using 1 mil diameter gold wire is
recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy should
be adjusted to the minimum required. RF bonds should be as short as possible.
Die Mounting
These chips have a Ti-Pt-Au back metal stack that can be die mounted using a gold-tin eutectic solder preform or
conductive Ag epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment
An 80/20 Gold-Tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool tip
temperature of 265°C. When hot gas is applied, the tool tip temperature should be ~290°C. The chip should not be
exposed to temperatures greater than 320°C for more than 20 seconds. No more than three seconds should be
required for the attachment.
Electrical Epoxy Die Attachment
Assembly should be preheated to 125-150°C. A controlled thickness of 2 mils is recommended for best electrical and
thermal conductivity. A thin epoxy fillet should be visible around the outer perimeter of the chip after placement to
ensure complete coverage. Cure epoxy per manufacturer’s schedule.
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