Mobile FCRAMTM. MB84VP24491HK-70 Datasheet
This document specifies SPANSIONTM memory products that are now offered by both Advanced Micro Devices and
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,
these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a SPANSIONTM product. Future routine
revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about SPANSIONTM memory
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
128M (×16) FLASH MEMORY &
32M (×16) Mobile FCRAMTM
• Power Supply Voltage of 2.7 V to 3.1 V
• High Performance
20 ns maximum page read access time, 70 ns maximum random access time (Flash)
20 ns maximum page read access time, 70 ns maximum random access time (FCRAM)
• Operating Temperature
–30 °C to +85 °C
• Package 73-ball FBGA
s PRODUCT LINEUP
Supply Voltage (V)
Max Random Address Access Time (ns)
Max Page Address Access Time (ns)
Max CE Access Time (ns)
Max OE Access Time (ns)
*: Both VCCf and VCCr must be the same level when either part is being accessed.
73-ball plastic FBGA