www.DataSheet4U.com
NPN SILICON HIGH FREQUENCY TRANSISTOR
FEATURES
• • • • SMALL PACKAGE STYLE: 2 NE688 Die in a 2 mm x...
www.DataSheet4U.com
NPN SILICON HIGH FREQUENCY
TRANSISTOR
FEATURES
SMALL PACKAGE STYLE: 2 NE688 Die in a 2 mm x 1.25 mm package LOW NOISE FIGURE: NF = 1.5 dB TYP at 2 GHz HIGH GAIN BANDWIDTH: fT = 9 GHz HIGH COLLECTOR CURRENT: 100 mA
0.65 2.0 ± 0.2 1.3 2 1
UPA814T
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
2.1 ± 0.1 1.25 ± 0.1
6 0.2 (All Leads) 5
DESCRIPTION
NEC's UPA814T is two
NPN high frequency silicon epitaxial
transistors encapsulated in an ultra small 6 pin SMT package. Each
transistor is independently mounted and easily configured for either dual
transistor or cascode operation. The high fT, low voltage bias and small size make this device suited for various hand-held wireless applications.
3
4
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS VCBO VCEO VEBO IC PT PARAMETERS Collector to Base Voltage Collector to Emitter Voltage Emitter to Base Voltage Collector Current Total Power Dissipation 1 Die 2 Die Junction Temperature Storage Temperature UNITS V V V mA mW mW °C °C RATINGS 9 6 2 100 110 200 150 -65 to +150
0.9 ± 0.1 0.7 0.15 - 0.05 0 ~ 0.1
+0.10
TJ TSTG
Note: 1.Operation in excess of any one of these parameters may result in permanent damage.
PIN OUT 1. Collector
Transistor 1 2. Base
Transistor 2 3. Collector
Transistor 2 4. Emitter
Transistor 2 5. Emitter
Transistor 1 6. Base
Transistor 1 Note: Pin 3 is identified with a circle on the bottom of the package.
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER PACKAGE OUTLINE SYMBOLS ICB...