Preliminary Data Sheet
FEATURES ♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
DRAIN BOND PAD
LPA6836V
MEDIUM POWER PHEMT WITH SOURCE VIAS
GATE BOND PAD
DESCRIPTION AND APPLICATIONS
DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (1...
