Volume Sensor. MPXC2012DT1 Datasheet
Rev. 3, 10/2004
High Volume Sensor for
Low Pressure Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure
sensor package which is ideal as a sub--module component or a disposable unit. The
unique concept of the Chip Pak allows great flexibility in system design while allowing an
economic solution for the designer. This new chip carrier package uses Freescale
Semiconductor’s unique sensor die with its piezoresistive technology, along with the
added feature of on--chip, thin--film temperature compensation and calibration.
NOTE: Freescale Semiconductor is also offering the Chip Pak package in
application--specific configurations, which will have an “SPX” prefix, followed by a
four--digit number, unique to the specific customer.
• Low Cost
• Integrated Temperature Compensation and Calibration
• Ratiometric to Supply Voltage
• Polysulfone Case Material (Medical, Class V Approved)
• Provided in Easy--to--Use Tape and Reel
• Respiratory Diagnostics
• Air Movement Control
• Pressure Switching
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak
(pressure is applied to the backside of the device). Front side die and wire protection
must be provided in the customer’s housing. Use caution when handling the devices
during all processes.
Freescale Semiconductor Preferred Device
0 to 75 mmHg (0 to 10 kPa)
CHIP PAK PACKAGE
1 Gnd 3 VS
2 S+ 4 S--
Freescale Semiconductor’s MPXC2011DT1/
MPXC2012DT1 Pressure Sensor has been designed for
medical usage by combining the performance of Freescale
Semiconductor’s shear stress pressure sensor design and
the use of biomedically approved materials. Materials with a
proven history in medical situations have been chosen to
provide a sensor that can be used with confidence in
applications, such as invasive blood pressure monitoring. It
can be sterilized using ethylene oxide. The portions of the
pressure sensor that are required to be biomedically
approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
The MPXC2011DT1 contains a silicone dielectric gel
which covers the silicon piezoresistive sensing element. The
gel is a nontoxic, nonallergenic elastomer system which
meets all USP XX Biological Testing Class V requirements.
The properties of the gel allow it to transmit pressure uni-
formly to the diaphragm surface, while isolating the internal
electrical connections from the corrosive effects of fluids,
such as saline solution. The gel provides electrical isolation
sufficient to withstand defibrillation testing, as specified in the
proposed Association for the Advancement of Medical
Instrumentation (AAMI) Standard for blood pressure trans-
ducers. A biomedically approved opaque filler in the gel pre-
vents bright operating room lights from affecting the
performance of the sensor.
The MPXC2012DT1 is a no--gel option.
Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
Sensor Device Data
Maximum Pressure (Backside)
Tstg --25 to +85
TA +15 to +40
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
— 10 kPa
VS — 3 10 Vdc
Full Scale Span(3)
Pressure Hysteresis(5) (0 to 10 kPa)
Temperature Hysteresis(5) (+15°C to +40°C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Zin 1300 — 2550 Ω
Response Time(6) (10% to 90%)
Zout 1400 — 3000 Ω
tR — 1.0 — ms
— — 20 — ms
— — ±0.5 — %VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self--heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Sensor Device Data