HIGH PERFORMANCE LOW NOISE PHEMT FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption
LPS200
GATE BOND PAD (2X) SOURCE BOND PAD (2x)
DRAIN BOND PAD (2X)
DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.3X2.6 mils (85x65 µm)
DESCRIPTION AND APPLICATIONS The LPS200 ...
