NSH03A09

www.DataSheet4U.com SBD FEATURES FEATURES Type : NSH03A09 OUTLINE DRAWING * FLAT-PAK Surface Mounting Device * Low Forward Voltage Drop * Low Power Loss,High Efficiency * High Surge Capability * Packaged in 16mm Tape and Reel * Not Rolling During Assembly Maximum Ratings Rating Repetitive Peak Reverse Voltage Average Rectified Output Current RMS Forward Current Surge Forward Current Operating JunctionTemperature Range Storage Temperature Range Approx Net Weight:0.16g Symbol VRRM Io IF(RMS) IFSM Tjw Tstg 60 1.57 3.0 NSH03A09 90 Ta=25°C *1 Tl=113°C 50Hz Half Sine Wave Resistive Load Unit V A A A °C °C 4.71 50Hz Half Sine Wave,1cycle Non-repetitive -40 to +150 -40 to +150 Electrical Thermal Characteristics Characteristics Symbol Conditions Min. Typ. Max. 1 0.85 89 13 Unit mA V °C /W Peak Reverse Current IRM Tj= 25°C, VRM= VRRM Peak Forward Voltage VFM Tj= 25°C, IFM= 3.0A Thermal Junction to Ambient Rth(j-a) Alumina Substrate Mounted *1 Resistance Junction to Lead Rth(j-l) *1 Alumina Substrate Mounted (Soldering Lands=2x3.5mm,Both Sides) (Tl: Lead Temperature) NSH03A09 OUTLINE DRAWING (Dimensions in mm) FORWARD CURRENT VS. VOLTAGE NSH03A09 20 INSTANTANEOUS FORWARD CURRENT (A) 10 5 2 Tj=25°C Tj=150°C 1 0.5 0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 INSTANTANEOUS FORWARD VOLTAGE (V) 0° θ 180° CONDUCTION ANGLE AVERAGE FORWARD POWER DISSIPATION NSH03A09 D.C. 3.5 AVERAGE FORWARD POWER DISSIPATION (W) 3.0 2.5 RECT 180° HALF SINE WAVE RECT 120° 2.0 RECT 60° 1.5 1...