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SIGC04T60 Datasheet, Equivalent, IGBT.

IGBT

IGBT

 

 

 

Part SIGC04T60
Description IGBT
Feature www.
DataSheet4U.
com SIGC04T60 IGBT Chip FEATURES:
• 600V Trench & Field Stop technology
• low VCE(sat)
• low tu rn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used f or:
• power module
• discrete compo nents Applications:
• drives
• whit e goods
• resonant applications C G E Chip Type SIGC04T60 VCE 600V ICn 6A Die Size 1.
98 x 1.
96 mm2 Package sawn on foil Ordering Code Q67050A4330 -A101 MECHANICAL PARAMETER: Raster siz e Emitter pad size Gate pad size Area t otal / active Thickness Wafer size Flat position Max.
possible chips per wa .
Manufacture Infineon Technologies
Datasheet
Download SIGC04T60 Datasheet
Part SIGC04T60
Description IGBT
Feature www.
DataSheet4U.
com SIGC04T60 IGBT Chip FEATURES:
• 600V Trench & Field Stop technology
• low VCE(sat)
• low tu rn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used f or:
• power module
• discrete compo nents Applications:
• drives
• whit e goods
• resonant applications C G E Chip Type SIGC04T60 VCE 600V ICn 6A Die Size 1.
98 x 1.
96 mm2 Package sawn on foil Ordering Code Q67050A4330 -A101 MECHANICAL PARAMETER: Raster siz e Emitter pad size Gate pad size Area t otal / active Thickness Wafer size Flat position Max.
possible chips per wa .
Manufacture Infineon Technologies
Datasheet
Download SIGC04T60 Datasheet

SIGC04T60

SIGC04T60
SIGC04T60

SIGC04T60

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