SIGC14T60NC

www.DataSheet4U.com SIGC14T60NC IGBT Chip in NPT-technology FEATURES: 600V NPT technology 100µm chip positive temperature coefficient easy paralleling C This chip is used for: IGBT Modules Applications: drives G E Chip Type SIGC14T60NC VCE 600V ICn 15A Die Size 3.8 x 3.8 mm2 Package sawn on foil Ordering Code Q67050-A4135A001 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 3.8 x 3.8 14.44 / 10.7 1.89 x 2.19 0.7 x 1.09 100 150 0 1032 Photoimide 3200 nm Al Si 1% 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, ≤500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C µm mm 2 mm deg Edited by INFINEON Technologies AI PS DD HV3, L 7232-M, Edition 2, 28.11.2003 SIGC14T60NC MAXIMUM RATINGS: Parameter Collector-emitter voltage, Tj=25 °C DC collector current, limited by Tjmax Pulsed collector current, tp limited by Tjmax Gate emitter voltage Operating junction and storage temperature 1) Symbol V CE IC Icpuls V GE Tj, Ts t g Value 600 1) Unit V A A V °C 45 ±20 -55 ... +150 depending on thermal properties of assembly STATIC CHARACTERISTICS (tested on chip), Tj=25 °C, unless otherwise specified: Pa...