SIGC156T60NR2C

www.DataSheet4U.com SIGC156T60NR2C IGBT Chip in NPT-technology FEATURES: 600V NPT technology 100µm chip short circuit prove positive temperature coefficient easy paralleling C This chip is used for: IGBT-Modules Applications: drives G E Chip Type VCE ICn 200A Die Size 12.5 x 12.5 mm2 Package sawn on foil Ordering Code Q67050-A4013A001 SIGC156T60NR2C 600V MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 12.5 x 12.5 156.25 / 138.2 8x( 2.58x4.78 ) 0.8 x 1.46 100 150 90 84 Photoimide 3200 nm Al Si 1% 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, ≤500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C µm mm deg mm 2 Edited by INFINEON Technologies AI PS DD HV3, L 7282-M, Edition 2, 28.11.2003 SIGC156T60NR2C MAXIMUM RATINGS: Parameter Collector-emitter voltage, Tj=25 °C DC collector current, limited by Tjmax Pulsed collector current, tp limited by Tjmax Gate emitter voltage Operating junction and storage temperature 1) Symbol V CE IC Icpuls V GE Tj, Ts t g Value 600 1) Unit V A A V °C 600 ±20 -55 ... +150 depending on thermal properties of assembly STATIC CHARACTERISTICS (tested on chip),...