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GS74108ATP Dataheets PDF



Part Number GS74108ATP
Manufacturers GSI Technology
Logo GSI Technology
Description 512K x 8 4Mb Asynchronous SRAM
Datasheet GS74108ATP DatasheetGS74108ATP Datasheet (PDF)

www.DataSheet4U.com GS74108ATP/J/X SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 120/95/85 mA at minimum cycle time • Single 3.3 V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40° to 85°C • Package line up J: 400 mil, 36-pin SOJ package GJ: RoHS-compliant 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP-II package GP: RoHS-compliant 400 mil, 44-pin.

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www.DataSheet4U.com GS74108ATP/J/X SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 120/95/85 mA at minimum cycle time • Single 3.3 V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40° to 85°C • Package line up J: 400 mil, 36-pin SOJ package GJ: RoHS-compliant 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP-II package GP: RoHS-compliant 400 mil, 44-pin TSOP-II package X: 6 mm x 10 mm FPBGA package GX: RoHS-compliant 6 mm x 10 mm FPBGA package • RoHS-compliant packages available A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 512K x 8 4Mb Asynchronous SRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 8, 10, 12 ns 3.3 V VDD Center VDD and VSS SOJ 512K x 8-Pin Configuration 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC 36-pin 400 mil SOJ Description The GS74108A is a high speed CMOS Static RAM organized as 524,288 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS74108A operates on a single 3.3 V power supply and all inputs and outputs are TTL-compatible. The GS74108A is available in 400 mil SOJ, 400 mil TSOP-II, and 6 mm x 10 mm FPBGA packages. FP-BGA 512K x 8 Bump Configuration (Package X) 1 2 3 4 5 6 Pin Descriptions Symbol A0–A18 DQ1–DQ8 CE WE OE VDD VSS NC Description Address input Data input/output Chip enable input Write enable input Output enable input +3.3 V power supply Ground No connect A B C D E F G H NC DQ1 DQ2 VSS VDD DQ3 DQ4 NC OE NC NC NC NC NC NC A16 A2 A1 A0 A18 A17 A13 A14 A15 A6 A5 A4 A3 A9 A10 A11 A12 A7 CE NC NC NC NC WE A8 NC DQ8 DQ7 VDD VSS DQ6 DQ5 NC 6 mm x 10 mm *All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional “G” designator are 6/6 RoHS compliant. Rev: 1.07 1/2006 1/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X TSOP-II 512K x 8-Pin Configuration NC NC A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC NC NC 44-pin 400 mil TSOP II Block Diagram A0 Address Input Buffer Row Decoder Memory Array A18 CE WE OE Column Decoder Control I/O Buffer DQ1 DQ8 Rev: 1.07 1/2006 2/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Truth Table CE H L L L Note: X: “H” or “L” OE X L X H WE X H L H DQ1 to DQ8 Not Selected Read Write High Z VDD Current ISB1, ISB2 IDD Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Voltage Allowable power dissipation Storage temperature Symbol VDD VIN VOUT PD TSTG Rating –0.5 to +4.6 –0.5 to VDD +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) 0.7 –55 to 150 Unit V V V W o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Recommended Operating Conditions Parameter Supply Voltage for -8/-10/-12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range Symbol VDD VIH VIL TAc TAI Min 3.0 2.0 –0.3 0 –40 Typ 3.3 — — — — Max 3.6 VDD +0.3 0.8 70 85 Unit V V V o C C o Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns. Rev: 1.07 1/2006 3/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Capacitance Parameter Input Capacitance Output Capacitance Symbol CIN COUT Test Condition VIN = 0 V VOUT = 0 V Max 5 7 Unit pF pF Notes: 1. Tested at TA = 25°C, f = 1 MHz 2. These parameters are sampled and are not 100% tested. DC I/O Pin Characteristics Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Symbol IIL ILO VOH VOL Test Conditions VIN = 0 to VDD Output High Z VOUT = 0 to VDD IOH = –4 mA ILO = +4 mA Min – 1 uA –1 uA 2.4 — Max 1 uA 1 uA — 0.4 V Power Supply Currents Parameter Symbol Test Conditions CE ≤ VIL All other inputs ≥ VIH or ≤ VIL Min. cycle time IOUT = 0 mA CE ≥ VIH All other inputs ≥ VIH or ≤VIL Min. cycle time CE ≥ VDD - 0.2V All other inputs ≥ VDD - 0.2V or ≤ 0.2V 0 to 70°C 8 ns 10 ns 12 ns 8 ns –40 to 85°C 10 ns 12 ns Operating Supply Current IDD 120 mA 95 mA 85 mA 130 m.


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