Surface Mounting Chip LED
Forward current IF (mA) (planed maintMeaniantnecRneeatlaFnytoicprvee/ew,alDriumdsmacciiunonrtorntueeisnnntiaunItneFecdn(...
Description
Forward current IF (mA) (planed maintMeaniantnecRneeatlaFnytoicprvee/ew,alDriumdsmacciiunonrtorntueeisnnntiaunItneFecdn(esiittmnyycAlp)(ue,d%)eplsafnolleodwdiinsgc foontiurnuPreoddtyucptelidf,edciysccloentsitnaugee.dDisMcaionnttiennuaendtype)ce/
Light Emitting Diodes
This product complies with the RoHS Directive (EU 2002/95/EC).
LNJ808R8ERA
Surface Mounting Chip LED
SS Type
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Power dissipation
PD
Forward current
IF
Pulse forward current *
IFP
Reverse voltage
VR
Operating ambient temperature
Topr
Storage temperature
Tstg
Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.
30 10 50 3 –25 to +85 –40 to +100
Unit mW mA mA V °C °C
Electro-Optical Characteristics Ta = 25°C
Parameter
Symbol
Luminous intensity Reverse current Forward voltage Peak emission wavelength Spectral half band width
IO IF = 5 mA IR VR = 3 V VF IF = 5 mA λP IF = 5 mA Δλ IF = 5 mA
Conditions
IO IF
IF ...
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