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JS28F800B3 Dataheets PDF



Part Number JS28F800B3
Manufacturers Intel
Logo Intel
Description (JS28Fxxx) Advanced Boot Block Flash Memory
Datasheet JS28F800B3 DatasheetJS28F800B3 Datasheet (PDF)

www.DataSheet4U.com Intel® Advanced Boot Block Flash Memory (B3) 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V read/program/erase — 12 V V PP fast production programming • Intel® Flash Data Integrator Software —Flash Memory Manager —System Interrupt Manager —Supports parameter storage, streaming data (for example, voice) • 1.65 V – .5 V or 2.7 V – 3.6 V I/O option — Reduces overall system power • High Performanc.

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www.DataSheet4U.com Intel® Advanced Boot Block Flash Memory (B3) 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V read/program/erase — 12 V V PP fast production programming • Intel® Flash Data Integrator Software —Flash Memory Manager —System Interrupt Manager —Supports parameter storage, streaming data (for example, voice) • 1.65 V – .5 V or 2.7 V – 3.6 V I/O option — Reduces overall system power • High Performance — 2.7 V – 3.6 V: 70 ns max access time • Extended Cycling Capability —Minimum 100,000 block erase cycles • Optimized Block Sizes — Eight 8-KB blocks for data, top or bottom locations — Up to 127 x 64-KB blocks for code • Automatic Power Savings Feature —Typical ICCS after bus inactivity • Standard Surface Mount Packaging —48-Ball CSP packages —40-Lead and 48-Lead TSOP packages • Block Locking — VCC-level control through Write Protect WP# • Density and Footprint Upgradeable for common package —8-, 16-, 32-, and 64-Mbit densities • Low Power Consumption — 9 mA typical read current • ETOX™ VIII (0.13 µm) Flash Technology —16-Mbit and 32-Mbit densities • Absolute Hardware-Protection — VPP = GND option — VCC lockout voltage • ETOX™ VII (0.18 µm) Flash Technology —16-, 32-, and 64-Mbit densities • Extended Temperature Operation — –40 °C to +85 °C • ETOX ™ VI (0.25µm) Flash Technology —8-, 16-, and 32-Mbit densities • Automated Program and Block Erase — Status registers • Bo not use the x8 option for new designs The Intel® Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.13 µm and 0.18 µm technologies, is a feature-rich solution at a low system cost. The B3 device in x16 is available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family is available only in 40-lead TSOP and 48-ball µBGA* packages. For additional information about this product family, see the Intel website: http://www.intel.com/design/flash. Notice: This specification is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design. Order Number: 290580, Revision: 020 18 Aug 2005 www.DataSheet4U.com INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Intel® Advanced Boot Block Flash Memory (B3) may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800 548-4725 or by visiting Intel's website at http://www.intel.com. Intel, the Intel logo, and ETOX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2005, Intel Corporation. 18 Aug 2005 2 Intel® Advanced Boot Block Flash Memory (B3) Order Number: 290580, Revision: 020 Datasheet www.DataSheet4U.com 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Contents 1.0 Introduction ............................................................................................................................... 7 1.1 1.2 Nomenclature ....................................................................................................................... 7 Conventions .......................................................................................................................... 8 2.0 Functional Overview .............................................................................................................. 8 3.0 Functional Overview .............................................................................................................. 9 3.1 3.2 Architecture Diagram .......................................................................................................... 10 Memory Maps and Block Organization ...................................


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