MSTF2GN-9R090Q

www.DataSheet4U.com THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.020" x 0.020" (±0.003") x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE SUBSTRA TE SUBSTRATE GOLD BACK OPTIONAL 0.020" A ELECTRICAL DA TA DAT 0.020" RESIST ANCE RANGE RESISTANCE SILICON, QUARTZ, GLASS ALUMINA ABSOLUTE TOLERANCE T.C.R. SILICON, QUARTZ, GLASS ALUMINA NICHROME 2Ω TO 1.5MΩ 2Ω TO 300KΩ 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE ±50ppm/°C ST ANDARD STANDARD OPTIONAL TO ±5ppm/°C ±50ppm/°C ST ANDARD STANDARD OPTIONAL TO ±25ppm/°C TANT ALUM NITRIDE ANTALUM 2Ω TO 1.5MΩ 2Ω TO 300KΩ 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE ±150ppm/°C ST ANDARD STANDARD OPTIONAL TO ±10ppm/°C ±150ppm/°C ST ANDARD STANDARD OPTIONAL TO±25ppm/°C Minimum bonding area for < 100 Ohm resistance. Layout varies with value. SERIES DA TA DAT CURRENT NOISE DIELECTRIC BREAKDOWN INSULA TION RESIST ANCE INSULATION RESISTANCE TING VOL TAGE OPERA OPERATING VOLT POWER RA TING RATING SILICON, ALUMINA QUARTZ, GLASS SHORT TERM OVERLOAD HIGH TEMP EXPOSURE THERMAL SHOCK MOISTURE RESIST ANCE RESISTANCE ST ABILITY STABILITY OPERA TING TEMP RANGE OPERATING STRAY DISTRIBUTED CAP ACIT ANCE CAPACIT ACITANCE SILICON / NiCr OR T aN TaN ALUMINA / NiCr ALUMINA / T aN TaN QUARTZ / NiCr QUARTZ / T aN TaN GLASS / NiCr GLASS / T aN TaN 101Ω TO 250KΩ: -40dB ≤ ...