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F9418AGC Dataheets PDF



Part Number F9418AGC
Manufacturers NEC
Logo NEC
Description UPD78F9418A
Datasheet F9418AGC DatasheetF9418AGC Datasheet (PDF)

www.DataSheet4U.com User’s Manual µPD789407A, 789417A Subseries 8-Bit Single-Chip Microcontrollers µPD789405A µPD789406A µPD789407A µPD789415A µPD789416A µPD789417A µPD78F9418A Document No. U13952EJ3V0UD00 (3rd edition) Date Published April 2003 N CP(K) 1999, 2003 Printed in Japan www.DataSheet4U.com [MEMO] 2 User’s Manual U13952EJ3V0UD www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can.

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www.DataSheet4U.com User’s Manual µPD789407A, 789417A Subseries 8-Bit Single-Chip Microcontrollers µPD789405A µPD789406A µPD789407A µPD789415A µPD789416A µPD789417A µPD78F9418A Document No. U13952EJ3V0UD00 (3rd edition) Date Published April 2003 N CP(K) 1999, 2003 Printed in Japan www.DataSheet4U.com [MEMO] 2 User’s Manual U13952EJ3V0UD www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. EEPROM and FIP are trademarks of NEC Electronics Corporation. Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. User’s Manual U13952EJ3V0UD 3 www.DataSheet4U.com These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of November, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, cus.


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