D72103A UPD72103A Datasheet

D72103A Datasheet, PDF, Equivalent


Part Number

D72103A

Description

UPD72103A

Manufacture

NEC

Total Page 30 Pages
Datasheet
Download D72103A Datasheet


D72103A
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µPD72103A
HDLC CONTROLLER
© 1997
µPD72103A
Document No. S10766EJ9V0UM00 (9th edition)
Date Published March 1997 N CP(N)
Printed in Japan

D72103A
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NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.


Features www.DataSheet4U.com µPD72103A HDLC CON TROLLER µPD72103A © 1997 Document No. S10766EJ9V0UM00 (9th edition) Date Published March 1997 N CP(N) Printed i n Japan www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electri c field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device oper ation. Steps must be taken to stop gene ration of static electricity as much as possible, and quickly dissipate it onc e, when it has occurred. Environmental control must be adequate. When it is dr y, humidifier should be used. It is rec ommended to avoid using insulators that easily build static electricity. Semic onductor devices must be stored and tra nsported in an anti-static container, s tatic shielding bag or conductive mater ial. All test and measurement tools inc luding work bench and floor should be g rounded. The operator should be grounde d using wrist strap. Semiconductor devices must not be touched wit.
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