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Data Sheet No. BDTC-800-1A
8 AMP SILICON BRIDGE RECTIFIERS
FEATURES MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
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SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.5 0.6 7.3 9.8 0.9 29.7 3.6 4.4 19.7 13.2 3.8 10.8 3.1 MAX 2.9 0.8 7.7 10.2 1.1 30.3 4.0 4.8 20.3 13.8 4.2 11.2 3.3
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SURGE OVERLOAD RATING TO 400 AMPS PEAK THRU-HOLE FOR EASY HEAT SINK MOUNTING
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INCHES MIN 0.098 0.024 0.287 0.386 0.035 1.17 0.142 0.173 0.776 0.520 0.126 0.425 0.122 MAX 0.114 0.031 0.303 0.402 0.043 1.19 0.157 0.189 0.799 0.543 0.165 0.441 0.130
MECHANICAL DATA
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SERIES DT8C00 - DT8C10
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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