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Digital Correlator. 11577-11 Datasheet |
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Construction Analysis
Rockwell 11577-11
Digital Correlator
Report Number: SCA 9707-546
al Semiconductor Ind
®
17350 N. Hartford Drive
Scottsdale, AZ 85255
Phone: 602-515-9780
Fax: 602-515-9781
e-mail: ice@ice-corp.com
Internet: http://www.ice-corp.com
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TITLE
INDEX TO TEXT
INTRODUCTION
MAJOR FINDINGS
TECHNOLOGY DESCRIPTION
Assembly
Die Process
ANALYSIS RESULTS I
Assembly
ANALYSIS RESULTS II
Die Process and Design
ANALYSIS PROCEDURE
TABLES
Overall Evaluation
Package Markings
Wirebond Strength
Die Material Analysis
Horizontal Dimensions
Vertical Dimensions
PAGE
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INTRODUCTION
This report describes a competitive analysis of the Rockwell 11577-11 digital correlator.
One device packaged in a 144-pin Square Quad Flat Package (SQFP) was received for the
analysis. The device was taken from a GPS receiver chipset manufactured by IST. The IC
was date coded 9636.
MAJOR FINDINGS
Questionable Items:1
• Metal 2 aluminum thinned up to 100 percent2 at some locations of some vias.
Barrier metal remained intact to provide continuity.
• Metal 1 aluminum thinned up to 100 percent2 at some locations of some contacts.
Barrier metal remained intact to provide continuity.
Special Features:
• Titanium silicided diffusion structures.
1These items present possible quality or reliability concerns. They should be discussed
with the manufacturer to determine their possible impact on the intended application.
2Seriousness depends on design margins.
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