www.DataSheet4U.com
PROCESS
Small Signal Transistor
PNP - High Current Transistor Chip
CP714
Central
TM
Semiconduc...
www.DataSheet4U.com
PROCESS
Small Signal
Transistor
PNP - High Current
Transistor Chip
CP714
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 7,070 PRINCIPAL DEVICE TYPES CBCP69 CBCX69 CZT751 MPS750 MPS751 EPITAXIAL PLANAR 40 x 40 MILS 9.0 MILS 7.9 x 8.7 MILS 9.0 x 14 MILS Al - 30,000Å Au - 18,000Å
BACKSIDE COLLECTOR
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R2 (1-August 2002)
www.DataSheet4U.com
Central
TM
PROCESS
CP714
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R2 (1-August 2002)
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