SC202H100A5

www.DataSheet4U.com Bulletin I0508J rev. B 05/01 SC202.....5.. Series SCHOTTKY DIE 200 x 200 mils (Monolithic Dual) a 0.25 ± 0.01 (10 ± 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). Anode d b Anode D c Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 5.08 + 0, - 0.01 (200 + 0, - 0.4) b = 5.08 + 0, - 0.01 (200 + 0, - 0.4) c = 4.92 + 0, - 0.01 (193 + 0, - 0.4) d = 2.43 + 0, - 0.01 (95 + 0, - 0.4) Ø = 1 ± 0.15 (40 ± 6) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2) Wafer flat alligned with side b of the die NOT TO SCALE 1 www.DataSheet4U.com SC202.....5. Series Preliminary Data Sheet I0508J rev. A 07/00 Electrical Characteristics Device # SC202S020A5 SC202S030A5 SC202S045A5 SC202S060A5 SC202H100A5 TJ Max. (°C) 150 150 150 150 150 VR (V) 20 30 45 60 100 Max. IR @ 25°C (mA) 8 2 2 2 0.55 (*) Max. VF @ IF (V) 0.42 V @ 40A per die, TJ= 25°C 0.46V @ 30A per die, TJ= 25°C 0.51 V @ 20A per die, TJ= 25°C 0.54V @ 15A per die, TJ= 25°C 0.69 V @ 10A per die, TJ= 25°C (*) For reference only, VF do not include voltage drop across wire bonding resistance Mechanical Data Device # Metal Thickness Front Metal Metal Thickness Back Metal SC202....A5.. Bondable -- Al/Si 30 kÅ -- Ti 1 kÅ Ni 4 kÅ Ag 6 kÅ Visual Inspection : see IR internal Spec. # 6373-2064 ...