PLANAR TRANSISTOR. HBF421 Datasheet

HBF421 TRANSISTOR. Datasheet pdf. Equivalent

HBF421 Datasheet
Recommendation HBF421 Datasheet
Part HBF421
Description PNP EPITAXIAL PLANAR TRANSISTOR
Feature HBF421; HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HA200214 Issued Date : 2002.08.01 Revised Date : 20.
Manufacture Hi-Sincerity Mocroelectronics
Datasheet
Download HBF421 Datasheet




Hi-Sincerity Mocroelectronics HBF421
HI-SINCERITY
MICROELECTRONICS CORP.
HBF421
PNP EPITAXIAL PLANAR TRANSISTOR
Spec. No. : HA200214
Issued Date : 2002.08.01
Revised Date : 2004.06.18
Page No. : 1/4
Description
Video B-class Power stages in TV-receivers
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Absolute Maximum Ratings
TO-92
Maximum Temperatures
Storage Temperature ........................................................................................................................... -55 ~ +150 °C
Junction Temperature ................................................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................................................... 830 mW
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................................................ -300 V
VCEO Collector to Emitter Voltage ..................................................................................................................... -300 V
VEBO Emitter to Base Voltage ............................................................................................................................... -5 V
IC Collector Current ........................................................................................................................................ -50 mA
IBM Peak Base Current ................................................................................................................................... -50 mA
ICM Peak Collector Current ........................................................................................................................... -100 mA
Electrical Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Min. Typ. Max.
-300
-
-
-300
-
-
-5 -
-
- - -100
- - -100
- - -0.6
50 -
-
60 -
-
Unit
V
V
V
nA
nA
V
MHz
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-200V, IE=0
VEB=-5V, IE=0
IC=-30mA, IB=-3mA
VCE=-20V, IC=-25mA
IE=-10mA, VCE=-10V, f=100MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HBF421
HSMC Product Specification



Hi-Sincerity Mocroelectronics HBF421
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HA200214
Issued Date : 2002.08.01
Revised Date : 2004.06.18
Page No. : 2/4
Current Gain & Collector Current
1000
hFE @ VCE=20V
Saturation Voltage & Collector Current
1000
VCE(sat) @ IC=6IB
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125oC
75oC
125oC
100
25oC
75oC
100
1
25oC
10
Collector Current-IC (mA)
100
10
1
10
Collector Current-IC (mA)
100
Saturation Voltage & Collector Current
1000
VCE(sat) @ IC=10IB
125oC
100
25oC
75oC
10
1
10
Collector Current-IC (mA)
100
Capacitance & Reverse-Biased Voltage
100
10
Cob
1
0.1
HBF421
1 10
Reverse Biased Voltage (V)
100
Saturation Voltage & Collector Current
1000
25oC
125oC
75oC
100
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
VBE(sat) @ IC=10IB
10
Collector Current-IC (mA)
PD - Ta
100
50 100 150
Ambient Temperature-Ta (oC )
200
HSMC Product Specification



Hi-Sincerity Mocroelectronics HBF421
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HA200214
Issued Date : 2002.08.01
Revised Date : 2004.06.18
Page No. : 3/4
TO-92 Dimension
A
B
123
α2
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H BF
421
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C
E
F
H
I
α3
D
G
α1
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-92 Plastic Package
HSMC Package Code: A
DIM Min. Max.
A 4.33 4.83
B 4.33 4.83
C 12.70
-
D 0.36 0.56
E - *1.27
F 3.36 3.76
G 0.36 0.56
H - *2.54
I - *1.27
α1 - *5°
α2 - *2°
α3 - *2°
*: Typical, Unit: mm
TO-92 Taping Dimension
DIM Min. Max.
A 4.33 4.83
H2 H2
H2AH2A
D2
D 3.80 4.20
D1 0.36 0.53
D2 4.33 4.83
A
F1,F2 2.40 2.90
H3 H 15.50 16.50
H1 8.50 9.50
H2 -
1
H2A -
1
L
L1
F1F2
H4 H
H3 - 27
H4 - 21
L - 11
H1
W1
L1 2.50
-
W P 12.50 12.90
P1 5.95 6.75
D1 D
P2 50.30 51.30
T - 0.55
T2 P1
TP
T1
P2
T1 - 1.42
T2 0.36 0.68
W 17.50 19.00
W1 5.00 7.00
Unit: mm
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBF421
HSMC Product Specification







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