DatasheetsPDF.com

CP645 Dataheets PDF



Part Number CP645
Manufacturers Central Semiconductor
Logo Central Semiconductor
Description Power Transistor PNP
Datasheet CP645 DatasheetCP645 Datasheet (PDF)

PROCESS CP645 Power Transistor PNP, 8.0A Power Transistor Chip Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area www.DataSheet4U.com MULTIEPITAXIAL MESA 120 x 145 MILS 13 MILS 20 x 45 MILS 14 x 70 MILS Al - 50,000Å Cr / Ni / Ag - 10,000Å Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 640 PRINCIPAL DEVICE TYPES MJE15031 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110.

  CP645   CP645



Document
PROCESS CP645 Power Transistor PNP, 8.0A Power Transistor Chip Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area www.DataSheet4U.com MULTIEPITAXIAL MESA 120 x 145 MILS 13 MILS 20 x 45 MILS 14 x 70 MILS Al - 50,000Å Cr / Ni / Ag - 10,000Å Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 640 PRINCIPAL DEVICE TYPES MJE15031 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R0 (4- April 2005) .


AD5441 CP645 CP643


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)