Document
APL5913
0.8V Reference Ultra Low Dropout (0.25V@3A) Linear Regulator
Features
General Description
• Ultra Low Dropout
The APL5913 is a 3A ultra low dropout linear regulator.
- 0.25V(typical) at 3A Output Current
This product is specifically designed to provide well sup-
• Low ESR Output Capacitor (Multi-layer Chip
ply volatage for front-side-bus termination on
Capacitors (MLCC)) Applicable
motherboards and NB applications. The IC needs two
• 0.8V Reference Voltage
supply voltages, a control voltage for the circuitry and a
• High Output Accuracy
main supply voltage for power conversion, to reduce
- ±1.5% over Line, Load and Temperature
power dissipation and provide extremely low dropout.
• Fast Transient Response
• Adjustable Output Voltage by External
The APL5913 integrates many functions. A Power-On-Re-
Resistors
set (POR) circuit monitors both supply voltages to pre-
• Power-On-Reset Monitoring on Both VCNTL and vent wrong operations. A thermal shutdown and current
VIN Pins
limit functions protect the device against thermal and cur-
• Internal Soft-Start
rent over-loads. A POK indicates the output status with
• Current-Limit Protection
time delay which is set internally. It can control other con-
• Under-Voltage Protection
verter for power sequence. The APL5913 is enabled by
• Thermal Shutdown with Hysteresis
other power system. Pulling and holding the EN pin be-
• Power-OK Output with a Delay Time
low 0.3V shuts off the output.
• Shutdown for Standby or Suspend Mode
The APL5913 is available in SOP-8P package which fea-
• Simple SOP-8P Package with Exposed Pad
tures small size as SOP-8 and an Exposed Pad to reduce
• Lead Free and Green Devices Available
the junction-to-case resistance, being applicable in
(RoHS Compliant)
2~2.4W applications.
Applications
• Front Side Bus VTT (1.2V/3A) • Note Book PC Applications • Motherboard Applications
Pin Configuration
GND 1
8 EN
FB 2 VOUT 3
VIN
7 POK 6 VCNTL
VOUT 4
5 VIN
SOP-8P (Top View)
= Exposed Pad (connected to VIN plane for better heat dissipation)
Copyright © ANPEC Electronics Corp.
1
Rev. A.7 - Apr., 2008
www.anpec.com.tw
APL5913
Ordering and Marking Information
APL5913
APL5913 KA :
Assembly Material Handling Code Temperature Range Package Code
APL5913 XXXXX
Package Code KA : SOP-8P
OpeCra:ti0ngtoA7m0boiCent Temperature Range Handing Code
TR : Tape & Reel Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
Block Diagram
EN
VCNTL VIN
UV 0.4V
Soft-Start and
Control Logic
PowerOn-Reset
Thermal Limit
VREF 0.8V
EAMP
FB
Current
Limit
POK
Delay
90% VREF
POK
VOUT GND
Copyright © ANPEC Electronics Corp.
2
Rev. A.7 - Apr., 2008
www.anpec.com.tw
APL5913
Typical Application Circuits
1. Using an Output Capacitor with ESR≥18mΩ
CCNTL 1µF
6
R3 1k POk
EN Enable
VCNTL
7 POk
VIN 5
VOUT 3 VOUT 4
APL5913
8 EN
FB 2
GND
1
R2
2k
VCNTL +5V
CIN 100µF
VIN +1.5V
VOUT +1.2V / 3A COUT 220µF
R1 1k
C1 33nF (in the range of 12 ~ 48nF)
2. Using an MLCC as the Output Capacitor
CCNTL 1µF
6
R3 1k POk
EN Enable
VCNTL
7 POk
VIN 5
VOUT 3 VOUT 4
APL5913
8 EN
FB 2
GND
1
R2
78k
CIN 22µF
R1 39k C1 56pF
VCNTL +5V
VIN +1.5V
COUT 22µF
VOUT +1.2V / 3A
VOUT (V) 1.05 1.5 1.8
R1 (kΩ) 43 27 15
R2 (kΩ) 137.6 30.86
12
C1 (pF) 47 82 150
Copyright © ANPEC Electronics Corp.
3
Rev. A.7 - Apr., 2008
www.anpec.com.tw
APL5913
Absolute Maximum Ratings
Symbol VCNTL VIN VI/O VPOK PD TJ TSTG TSDR
Parameter VCNTL Supply Voltage (VCNTL to GND) VIN Supply Voltage (VIN to GND) EN and FB to GND POK to GND Power Dissipation Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds
Rating -0.3 ~ 7 -0.3 ~ 3.3 -0.3 ~ VCNTL+0.3 -0.3 ~ 7
3 150 -65 ~ 150 260
Unit V V V V W oC oC oC
Thermal Characteristics
Symbol θJA θJC
Parameter Junction-to-Ambient Thermal Resistance in Free Air (Note1) Junction-to-Case Thermal Resistance in Free Air (Note 2)
Value 42 18
Unit oC/W oC/W
Note 1 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of SOP-8P is soldered directly on the PCB.
Note 2 : The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.
1
8
2
VIN
7
3
6
4
5
Measured Point
PCB Copper
Recommended Operating Conditions
Symbol VCNTL VIN.