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TSM2311 Dataheets PDF



Part Number TSM2311
Manufacturers Taiwan Semiconductor Company
Logo Taiwan Semiconductor Company
Description 20V P-Channel Enhancement Mode MOSFET
Datasheet TSM2311 DatasheetTSM2311 Datasheet (PDF)

TSM2311 20V P-Channel Enhancement Mode MOSFET Pin assignment: 1. Gate 2. Source 3. Drain VDS = - 20V RDS (on), Vgs @ - 4.5V, Ids @ - 4.0A = 55mΩ RDS (on), Vgs @ - 2.5V, Ids @ - 2.5A = 85mΩ www.DataSheet4U.com Features Advanced trench process technology High density cell design for ultra low on-resistance Excellent thermal and electrical capabilities Compact and low profile SOT-23 package Block Diagram Ordering Information Part No. TSM2311CX Packing Tape & Reel Package SOT-23 Absolute Maxim.

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TSM2311 20V P-Channel Enhancement Mode MOSFET Pin assignment: 1. Gate 2. Source 3. Drain VDS = - 20V RDS (on), Vgs @ - 4.5V, Ids @ - 4.0A = 55mΩ RDS (on), Vgs @ - 2.5V, Ids @ - 2.5A = 85mΩ www.DataSheet4U.com Features Advanced trench process technology High density cell design for ultra low on-resistance Excellent thermal and electrical capabilities Compact and low profile SOT-23 package Block Diagram Ordering Information Part No. TSM2311CX Packing Tape & Reel Package SOT-23 Absolute Maximum Rating (Ta = 25 oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation Ta = 25 C Ta = 75 oC Operating Junction Temperature Operating Junction and Storage Temperature Range TJ TJ, TSTG o Symbol VDS VGS ID IDM PD Limit - 20V ±8 -4 - 20 1.25 0.8 +150 - 55 to +150 Unit V V A A W o o C C Thermal Performance Parameter Lead Temperature (1/8” from case) Junction to Ambient Thermal Resistance (PCB mounted) Note: Surface mounted on FR4 board t<=5sec. Symbol TL Rθja Limit 5 100 Unit S o C/W TSM2311 1-1 2003/12 rev. B Electrical Characteristics Ta = 25 oC, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State www.DataSheet4U.com Conditions Symbol Min Typ Max Unit VGS = 0V, ID = - 250uA VGS = - 4.5V, ID = -4.0A VGS = - 2.5V, ID = -2.5A VDS = VGS, ID = - 250uA VDS = - 16V, VGS = 0V VGS = ± 8V, VDS = 0V VDS ≧- 10V, VGS = -4.5V VDS = - 5V, ID = - 4.0A BVDSS RDS(ON) RDS(ON) VGS(TH) IDSS IGSS ID(ON) gfs - 20 -- -45 -55 V Resistance Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage On-State Drain Current Forward Transconductance - 0.45 ---6 -----9 -- 1.0 ± 100 ---75 85 mΩ V uA nA A S Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Max. Diode Forward Current Diode Forward Voltage IS = - 1.6A, VGS = 0V IS VSD ---- 0.8 - 1.6 - 1.2 A V VDS = - 6V, VGS = 0V, f = 1.0MHz VDD = - 4V, RL = 4Ω, ID = - 1A, VGEN = - 4.5V, RG = 6Ω VDS = - 6V, ID = - 4.0A, VGS = - 4.5V Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss ----------8.5 1.5 2.1 18 45 95 65 970 485 160 12 ---------pF nS nC Note : pulse test: pulse width <=300uS, duty cycle <=2% TSM2311 2-2 2003/12 rev. B SOT-23 Mechanical Drawing A B www.DataSheet4U.com F DIM A B C D E SOT-23 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX 2.88 2.91 0.113 0.115 0.39 0.42 0.015 0.017 1.78 2.03 0.070 0.080 0.51 0.61 0.020 0.024 1.59 1.66 0.063 0.065 1.04 0.07 1.08 0.09 0.041 0.003 0.043 0.004 E G F G D C TSM2311 3-3 2003/12 rev. B .


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