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HX6656

Honeywell

32K x 8 ROM-SOI

Military & Space Products 32K x 8 ROM—SOI FEATURES RADIATION • Fabricated with RICMOS™ IV Silicon on Insulator (SOI) 0....


Honeywell

HX6656

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Description
Military & Space Products 32K x 8 ROM—SOI FEATURES RADIATION Fabricated with RICMOS™ IV Silicon on Insulator (SOI) 0.75 µm Process (Leff = 0.6 µm) Total Dose Hardness through 1x106 rad(SiO2) Typical Operating Power <15 mW/MHz Dynamic and Static Transient Upset www.DataSheet4U.com Hardness through 1x109 rad(Si)/s Dose Rate Survivability through 1x1011 rad(Si)/s Neutron Hardness through 1x1014 cm-2 SEU Immune Latchup Free Asynchronous Operation CMOS or TTL Compatible I/O Single 5 V ± 10% Power Supply OTHER Read Cycle Times < 17 ns (Typical) ≤ 25 ns (-55 to 125°C) HX6656 Packaging Options - 28-Lead Flat Pack (0.500 in. x 0.720 in.) - 28-Lead DIP, MIL-STD-1835, CDIP2-T28 - 36-Lead Flat Pack (0.630 in. x 0.650 in.) GENERAL DESCRIPTION The 32K x 8 Radiation Hardened ROM is a high performance 32,768 word x 8-bit read only memory with industrystandard functionality. It is fabricated with Honeywell’s radiation hardened technology, and is designed for use in systems operating in radiation environments. The ROM operates over the full military temperature range and requires only a single 5 V ± 10% power supply. The ROM is available with either TTL or CMOS compatible I/O. Power consumption is typically less than 15 mW/MHz in operation, and less than 5 mW when de-selected. The ROM operation is fully asynchronous, with an associated typical access time of 14 ns. Honeywell’s enhanced SOI RICMOS™ IV (Radiation Insensitive CMOS) technology is radiation hardened th...




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