Mount ChipLED. ASMT-CA00 Datasheet

ASMT-CA00 ChipLED. Datasheet pdf. Equivalent

Part ASMT-CA00
Description 0.4mm Low Profile Right Angle Surface Mount ChipLED
Feature ASMT-CA00 AlInGaP Amber, 0.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Descriptio.
Manufacture AVAGO TECHNOLOGIES
Datasheet
Download ASMT-CA00 Datasheet




ASMT-CA00
ASMT-CA00
AlInGaP Amber, 0.4mm Low Profile
Right Angle Surface Mount ChipLED
Data Sheet
Description
The ASMT-CA00 of amber color chip-type LEDs is
designed with the smallest footprint to achieve high
density of components on board. They have the industry
www.DataSheet4sUta.cnodmard footprint 1.6 mm x 1.0 mm and a height of only
0.4 mm. This makes them very suitable for cellular phone
and mobile equipment backlighting and indication ap-
plication where space is a constraint. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in conductive tape and reel, with 4000 units per
reel. These part are compatible with IR soldering.
Package Dimension
0.20
0.008
1.60
0.063
0.20
0.008
0.40`0.05
0.016`0.002
1.20
0.047
Features
Small size right angle mount
0603 industry standard footprint
0.4 mm low profile type
Operating temperature range of -30°C to +85 °C
Compatible with IR reflow soldering process
Available in 8mm tape on 178mm (7’) diameter reels
Reel sealed in zip locked moisture barrier bags
Applications
LCD Backlighting
Keypad Side / Backlighting
Pushbutton backlighting
Symbol Indicator
R0.60
0.024
1.00
0.039
0.50
0.020
SIDE VIEW
CATHODE MARK
0.20
0.009
0.30
0.012
TOP VIEW
0.30
0.012
0.35
0.014
0.30
0.012
0.35
0.014
TERMINAL VIEW
Notes:
1. All dimensions will be in millimeters (inches)
2. Tolerance is ±0.1mm (±0.004 in) unless otherwise stated
CAUTION: ASMT-CA00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.



ASMT-CA00
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 1.0 (W) x 0.4 (H)
Parts per Reel
4000
Package Description
Untinted, Non-diffused
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current [1]
Power Dissipation
Reverse Voltage (IR = 100μA)
LED Junction Temperature
www.DataSheet4UO.pceoramting Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
ASMT-CA00
25
60
5
95
-30 to +85
-40 to +85
See reflow soldering profile (Figure 7 & 8)
Unit
mA
mW
V
°C
°C
°C
Electrical Characteristics at TA = 25°C
Part Number
Forward Voltage
VF (Volts) [1] @ IF = 20mA
Typ. Max.
ASMT-CA00 1.9
2.4
Notes:
1. Vf tolerance : ±0.1V
Reverse Breakdown
VR (Volts) @ IR = 100μA
Min.
5
Thermal Resistance
RθJ-PIN (°C/W)
Typ.
400
Optical Characteristics at TA = 25°C
Part Number
Luminous Intensity
IV [1] (mcd) @ 20mA
Min. Typ.
Peak Wavelength
λpeak (nm)
Typ.
Dominant Wavelength
λd [2] (nm)
Typ.
Viewing Angle
2 θ1/2 [3] (Degrees)
Typ.
ASMT-CA00 28.5
90
595
592
150
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.








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